-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueDo You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
Technical Resources
Key industry organizations–all with knowledge sharing as a part of their mission–share their technical repositories in this issue of SMT007 Magazine. Where can you find information critical to your work? Odds are, right here.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Koh Young at SEMICON West with a Focus on Inspection & Metrology for Semiconductor and Advanced Packaging Challenges
June 4, 2024 | Koh YoungEstimated reading time: 1 minute

Koh Young, the industry leader in True3D measurement-based inspection solutions, will demonstrate its ZenStar and Meister Series of automated inspection and metrology tools for semiconductor and advanced package applications in booth 1833 at SEMICON West, taking place from July 9-11, 2024, at the Moscone Center in San Francisco, CA.
For over two decades, Koh Young has been a global leader in the field of 3D inspection and measurement technology. Our journey began with a vision to enhance precision and efficiency in electronics manufacturing. Today, we stand at the forefront of revolutionizing the semiconductor industry with our innovative metrology solutions. Using our True3D™ measurement-based inspection technologies, including the ZenStar and Meister Series, manufacturers can tackle critical manufacturing challenges in advanced packaging. These technologies provide real-time insights and predictive analytics to drive smarter manufacturing decisions, achieve higher yields, reduce defects, and improve overall productivity.
Meister S Premium In-line 3D Inspection System for Micro Solder Paste Deposits
Combining innovative vision algorithms and high-resolution optic technology, the Meister S is the ultimate, True 3D SPI solution for the semiconductor & Mini/Micro-LED packaging process improvement.
- High-resolution optics with a high-speed camera system (0.1 µm Z resolution)
- High-speed 25 Mega-pixel Camera with 3.5-micron Resolution Optics
- 10-micron Thins Solder Paste Inspection
- Colored and Transparent Flux Inspection
Meister D+ Breakthrough in 3D Measurement for Highly Reflective, Shiny Die
The Meister D+ combines industry-leading Moiré technology to inspect for micro cracks, chipping, foreign material, and more and our new proprietary optics to support highly-reflective die inspection, a challenge historically plaguing the industry.
- Small Die and Component Inspection (0201 metric / 008004 EIA)
- Narrow-gap Inspection down to 50-microns
- Height and Tilt Measurement in High Density, Highly Reflective Applications
ZenStar True 3D Measurement for Wafer-level Packaging Applications
Combining innovative vision algorithms and high-resolution optical technology, the ZenStar inspects highly reflective die as well as components. With proprietary deep learning technology, it offers enhanced capabilities to inspect defects like micro-cracks, foreign material, chipping, and more.
- Industry-leading metrology capabilities with deep learning technology
- 10-micron diameter wafer bump inspection
- Full 3D height and tilt measurement for even highly reflective die surfaces
Suggested Items
Yamaha Reveals Latest Updates Boosting Ease of Use in 1 STOP SMART SOLUTION
04/01/2025 | Yamaha Robotics SMT SectionYamaha Robotics SMT Section has announced automated programming capabilities in YSUP factory software that streamline program generation for all surface-mount processes, including dispensing, printing, placement, and inspection.
Delvitech Expands Its Presence in Germany with the Appointment of Bijan Thomas Rahideh as Representative
03/31/2025 | DelvitechDelvitech, a leader in AI-driven automated optical inspection solutions, is strengthening its position in the German-speaking market by appointing Bijan Thomas Rahideh as its representative for Bavaria, Austria, and German-speaking regions of Switzerland.
Real Time with... IPC APEX EXPO 2025: Koh Young—AI's Impact on the Electronics Industry
03/27/2025 | Real Time with...IPC APEX EXPOKoh Young's Joel Scutchfield discusses the role of AI in the electronics industry. He emphasizes data quality's importance for automation and the development of AI engines for specific tools. The conversation covers market trends in PCB and semiconductor technologies, trade negotiations, and the challenges of reshoring.
Datest to Highlight Flying Probe Programming and X-ray Testing Services at Upcoming SMTA Texas Expos
03/25/2025 | DatestDatest, a leading provider of integrated PCBA testing, imaging, inspection, and failure analysis services for the electronics industry, is excited to announce it will exhibit in the upcoming SMTA Dallas Expo on Tuesday, April 1st, and the SMTA Houston Expo on Thursday, April 3rd, 2025.
Real Time with... IPC APEX EXPO 2025: Expanding Horizons—Technica's New Partnership and Innovations
03/25/2025 | Real Time with...IPC APEX EXPOFrank Medina and Juan Arango share their enthusiasm for a new partnership that expands Technica's territory and product offerings under EMC's ownership. They highlight unique technologies like laser inspection, which offers faster solutions than traditional methods.