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Koh Young at SEMICON West with a Focus on Inspection & Metrology for Semiconductor and Advanced Packaging Challenges
June 4, 2024 | Koh YoungEstimated reading time: 1 minute

Koh Young, the industry leader in True3D measurement-based inspection solutions, will demonstrate its ZenStar and Meister Series of automated inspection and metrology tools for semiconductor and advanced package applications in booth 1833 at SEMICON West, taking place from July 9-11, 2024, at the Moscone Center in San Francisco, CA.
For over two decades, Koh Young has been a global leader in the field of 3D inspection and measurement technology. Our journey began with a vision to enhance precision and efficiency in electronics manufacturing. Today, we stand at the forefront of revolutionizing the semiconductor industry with our innovative metrology solutions. Using our True3D™ measurement-based inspection technologies, including the ZenStar and Meister Series, manufacturers can tackle critical manufacturing challenges in advanced packaging. These technologies provide real-time insights and predictive analytics to drive smarter manufacturing decisions, achieve higher yields, reduce defects, and improve overall productivity.
Meister S Premium In-line 3D Inspection System for Micro Solder Paste Deposits
Combining innovative vision algorithms and high-resolution optic technology, the Meister S is the ultimate, True 3D SPI solution for the semiconductor & Mini/Micro-LED packaging process improvement.
- High-resolution optics with a high-speed camera system (0.1 µm Z resolution)
- High-speed 25 Mega-pixel Camera with 3.5-micron Resolution Optics
- 10-micron Thins Solder Paste Inspection
- Colored and Transparent Flux Inspection
Meister D+ Breakthrough in 3D Measurement for Highly Reflective, Shiny Die
The Meister D+ combines industry-leading Moiré technology to inspect for micro cracks, chipping, foreign material, and more and our new proprietary optics to support highly-reflective die inspection, a challenge historically plaguing the industry.
- Small Die and Component Inspection (0201 metric / 008004 EIA)
- Narrow-gap Inspection down to 50-microns
- Height and Tilt Measurement in High Density, Highly Reflective Applications
ZenStar True 3D Measurement for Wafer-level Packaging Applications
Combining innovative vision algorithms and high-resolution optical technology, the ZenStar inspects highly reflective die as well as components. With proprietary deep learning technology, it offers enhanced capabilities to inspect defects like micro-cracks, foreign material, chipping, and more.
- Industry-leading metrology capabilities with deep learning technology
- 10-micron diameter wafer bump inspection
- Full 3D height and tilt measurement for even highly reflective die surfaces
Suggested Items
Koh Young Installs 24,000th Inspection System at Fabrinet Chonburi
04/23/2025 | Koh YoungKoh Young, the global leader in True 3D measurement-based inspection and metrology solutions, proudly announces the installation of its 24,000th inspection system at Fabrinet Chonburi in Thailand. This advanced facility is operated by Fabrinet Co., Ltd., a global provider of advanced manufacturing services, specializing in complex optical, electro-optical, and electronic products
The Future of Advanced Packaging Inspection Is X-ray
04/22/2025 | David Kruidhof and Kevin Jan, Comet YxlonDriven by smartphones, high-performance computers, and artificial intelligence, the global demand for high-end computing power is constantly rising. The industry is also facing demands for miniaturization, which creates the need for ever-smaller defect recognition. The semiconductor industry has been identifying and solving these challenges for decades using various optical inspection and SEM tools.
Yamaha Boosts YRi-V AOI Productivity with 3D Component Update
04/22/2025 | Yamaha RoboticsYamaha Robotics Europe SMT Section has introduced instantaneous 3D component update, included with the latest software release for YRi-V automatic optical inspection (AOI) systems, letting users optimise inspection programs without stopping production.
ViTrox Marks 25 Years of Innovation with Cutting-Edge Solutions at NEPCON China 2025 in Shanghai
04/18/2025 | ViTrox TechnologiesViTrox, which aims to be the World’s Most Trusted Technology Company, is proud to announce its participation in NEPCON China 2025, taking place from April 22–24, 2025, at Booth #1E45, Shanghai World Expo Exhibition & Convention Centre (SWEECC).
Saki America, Appoints Mario Ramírez Galindo as Project Engineer in Mexico
04/17/2025 | Saki America,Saki America, Inc., an innovator in the field of automated optical and X-ray inspection equipment, is pleased to announce the appointment of Mario Ramírez Galindo as Project Engineer in Mexico. In this role, Mario will support Saki’s customers by providing technical expertise, process optimization, and project management to enhance manufacturing efficiency and inspection accuracy.