Standard of Excellence: Speed vs. Quality in Customer Service
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
NextFlex Launches $5.3 Million Funding Opportunity to Strengthen U.S. Electronics Manufacturing and Promote Commercialization of Hybrid Electronics
June 10, 2024 | BUSINESS WIREEstimated reading time: 2 minutes
NextFlex, the Department of Defense (DoD) sponsored Manufacturing Innovation Institute focused on maturing hybrid electronics, today released Project Call 9.0 (PC 9.0), its latest call for proposals that seek to fund projects that further the development and adoption of hybrid electronics while addressing key challenges in advanced manufacturing. The total PC 9.0 project value is expected to exceed $11M (including NextFlex investment and performer cost-share), bringing the total anticipated investment in advancing hybrid electronics since NextFlex’s formation to $143M.
Building from the success of past Project Calls, PC 9.0 uses broadly defined topics to enable a diverse proposer base, with special emphasis on areas in which hybrid electronics can impact high priority U.S. manufacturing opportunities and areas of emerging importance within the electronics manufacturing community. PC 9.0 emphasizes projects that address critical hybrid electronics manufacturing challenges, enabling the transition of hybrid electronics devices into applications that require superior performance, assured reliability, and improved environmental sustainability.
“NextFlex Project Calls advance the state of the art of hybrid electronics technology and have proven to push the field in new directions, with each marking development milestones that have been collectively achieved by the NextFlex consortium. PC 9.0 continues this trend, with increased emphasis on projects that will lead to technology transitions into both commercial markets and defense programs.” said Dr. Scott Miller, Director of Technology at NextFlex. “As hybrid electronics technologies increasingly find their way into products and manufacturing, these developments will expand the range of applications in aerospace, automotive, structural health monitoring, and medical wearables.”
Proposals focused on manufacturing challenges and advancing technology transitions are sought in these topic areas:
Topic 9.1: Manufacturing of High Resolution, Multilayer Electronic Packages and Devices
Topic 9.2: Thermal Management for Power Electronics
Topic 9.3: Reliable Hybrid Electronics for Extreme Conditions
Topic 9.4: Conformal & Structurally Integrated Hybrid Electronics
Topic 9.5: Additive Processes for Improved Environmental Sustainability of Electronics Manufacturing
Topic 9.6: Open Topic for "New Project Leads"
In addition, NextFlex announces the release of its latest public Hybrid Electronics Technology Roadmaps. Developed by subject matter experts from industry, academia and government. The NextFlex Technical Working Groups in 11 technical areas of emphasis – Automotive; Device Integration & Packaging; Materials; Modeling & Design; Printed Components & Microfluidics; Standards, Test & Reliability; Asset Monitoring Systems; Flexible Power; Human Monitoring Systems; Integrated Antenna Arrays; and Soft Wearable Robotics – update the roadmaps each year. The public roadmaps summarize the detailed information on the current state of the art, market opportunities and needs, key stakeholders, a five-year forward-looking development roadmap, and prioritized technical gaps identified by each Technical Working Group in the full-version roadmaps to which NextFlex members have access. These roadmaps inform the priorities and shape the topics for NextFlex Project Calls.
More information on NextFlex’s PC 9.0, including proposal submission instructions and registration for the Proposer’s Day & Teaming webinar on June 10, can be found at nextflex.us/project-call-9-0. Proposals are due July 24.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
The Training Connection Continues to Grow with Addition of Veteran IPC Trainer Bill Graver
10/30/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce the addition of Bill Graver to its growing team of industry experts. A respected professional with more than 35 years in electronics manufacturing, Bill joins as an IPC Master Trainer, bringing a wealth of hands-on experience in PCB testing, failure analysis, and process improvement.
I-Connect007 Welcomes New Columnist: Leo Lambert, EPTAC
10/30/2025 | I-Connect007I-Connect007 is excited to announce a column by Leo Lambert, an industry veteran with 40 years of experience, an award winner, and technical director at EPTAC. This column, Learning With Leo, will explore the evolution and related challenges of electronics product assembly, especially as it relates to training.
Cicor to Acquire UK-Based TT Electronics with Board Support
10/30/2025 | Cicor Technologies Ltd.Cicor is a globally active provider of full-cycle electronic solutions (EMS) for the healthcare technology, industrial, and aerospace & defense sectors. TT is a UK-based, London Stock Exchange-listed global provider of engineered electronics for performance critical applications.
Building PCBs and Policy in Europe: Group ACB Champions Advocacy, Standards Development, and Technical Leadership
10/30/2025 | Linda Stepanich, Community MagazineHow does a European PCB manufacturer navigate the competitive manufacturing landscape in Europe? By participating in standards development committee meetings, testifying before the European Commission on industry issues, and sponsoring hand-soldering competitions in the region. Group ACB, based in France and Belgium, focuses on high-reliability applications. The 37-year-old company is also active in the Global Electronics Association, giving credit for helping ACB to raise awareness of electronics manufacturing in Europe.
Highlights at productronica 2025
10/29/2025 | productronicaJust a few more weeks to go before the anniversary edition of productronica. The world’s leading trade fair for the development and production of electronics celebrates its 50th anniversary this fall. From November 18 to 21, Munich will once again be the meeting place for the international electronics industry.