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Collaboration and Data Management the Focus of Latest Podcast From Cadence and I-Connect007
June 19, 2024 | I-Connect007Estimated reading time: Less than a minute
I-Connect007 is happy to announce the release of the latest episode in Series 3 of On the Line With..., now available here and on Apple and Spotify.
In “PCB 3.0: A New Design Methodology—Data Management,” product engineering expert Mark Hepburn joins the podcast to discuss the value of collaboration in the printed circuit board design and manufacturing cycle. Hepburn shares his views on how the latest data infrastructures are changing and enabling greater—and safer—data sharing.
I-Connect007 is dedicated to providing our reader community with a wide range of digital content to help them succeed in the industry. From magazines, books, and newsletters to market reports, podcasts, and event coverage, we deliver digital content that meets the needs of our community.
I-Connect007 is the longest-running digital media company in the industry and a leading publisher of original, exclusive content for the global electronics supply chain.
Listen now to Episodes 1-6 of PCB 3.0: A New Design Methodology.
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IPC President's Award: Barry Matties
04/21/2025 | Pete Starkey, I-Connect007The IPC President’s Award is given to IPC members who have exhibited ongoing leadership in IPC and have made significant contributions of their time and talent to the association and the electronic interconnect industry. Individuals can receive this award only once. Barry Matties has been a leading global force in publishing content about the electronics industry for nearly 40 years. He began his publishing career as a co-founder of CircuiTree Magazine in 1987, which became the leading printed trade journal serving the PCB industry.
Four Industry Leaders Receive IPC President’s Award at IPC APEX EXPO 2025
03/21/2025 | IPCIn recognition of their leadership and significant contributions of time and talent to IPC and the electronics industry, four IPC volunteers were presented with the IPC President’s Award at IPC APEX EXPO in Anaheim, California, on March 18, 2025.
Paige Fiet: From Emerging Engineer to Quality at TTM
03/19/2025 | Marcy LaRont, PCB007 MagazinePaige Fiet is a graduate of the IPC Emerging Engineer program and now works at TTM Technologies in Logan, Utah. She was an IPC Student Board Member and has been a columnist for I-Connect007. She is a stellar example and an encouragement to other young engineers about how to be successful in your early career.
Paige Fiet: From Emerging Engineer to Quality at TTM
03/19/2025 | I-Connect007 Editorial TeamPaige Fiet is a graduate of the IPC Emerging Engineer program and now works at TTM Technologies in Logan, Utah. She was an IPC Student Board Member and has been a columnist for I-Connect007. She is a stellar example and an encouragement to other young engineers about how to be successful in your early career.