-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssuePartial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
Silicon to Systems: From Soup to Nuts
This month, we asked our expert contributors to weigh in on silicon to systems—what it means to PCB designers and design engineers, EDA companies, and the rest of the PCB supply chain... from soup to nuts.
Cost Drivers
In this month’s issue of Design007 Magazine, our expert contributors explain the impact of cost drivers on PCB designs and the need to consider a design budget. They discuss the myriad design cycle cost adders—hidden and not so hidden—and ways to add value.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
An IPC ‘Blockbuster’: IPC-7711/21
June 11, 2024 | Teresa Rowe, IPC Senior Director, Assembly and Standards TechnologyEstimated reading time: 1 minute
Dan Foster, Missile Defense Agency, has been instrumental in developing IPC-7711/21, Rework, Modification and Repair of Electronics Assemblies, over several revisions of this important guideline document. We talked to Dan and committee member Agnieszka Ozarowski, BAE Systems, about the most recent revision.
IPC-7711/21 is the replacement guideline for IPC-R-700C, a document last updated in 1989. In 1998, Dan led the first meeting for the creation of IPC 7711/21 and recalls why R-700 needed to be updated.
“We were using, like, two hair dryers to remove components by hot air at that time,” he says.
Technology had changed, and R-700 needed to be replaced. IPC-7711/21 is different from others in the IPC library. It is a guideline, not a standard, offering information on how to do rework and repair on boards and assemblies. IPC-7711/21D provides easier-to-follow guidelines, new visual aids, procedures, tools, methods, and materials for restoring electronic assemblies.
Each procedure has been reformatted to make it easier for the reader to understand, and the format is more in line with standards.
“The big thing about 7711/21 is that it has procedures, but they are flexible,” Dan says. “We wanted to give people core procedures to use, and those can be modified. People tend to treat it like a standard, and we need to remind them that it is not.”
The first thing he tells others is to read the front of the book. “Nobody wants to, but we changed procedures with a simple note up front, stating whether procedures will work for lead or lead-free,” Dan says. “But you need to understand the features—different fluxes and higher temps. We refer to all that in the front of the document. In revision D, you will see many changes to the General Information section of the document. Team Iron, the A-Team responsible for the content, worked to bring it up to date.”
To read the entire article, which appeared in the Spring 2024 issue of Community Magazine, click here.
Suggested Items
Global Top 5 SSD Module Makers Continue to Gain Market Share; Chinese Brands Leverage Home Advantage
10/23/2024 | TrendForceTrendForce’s latest investigations reveal that the combined market share of the top five SSD module makers in the retail sector has surged from 59% in 2022 to 72% in 2023, reinforcing a trend of larger companies expanding their dominance.
Alpha and Omega Semiconductor to Exhibit at electronica 2024
10/23/2024 | AOSAlpha and Omega Semiconductor Limited (AOS), a designer, developer, and global supplier of a broad range of discrete power devices, wide band gap power devices, power management ICs, and modules, today announced it will exhibit and demonstrate the capabilities of its expanding line of breakthrough application-specific power semiconductor, power IC and module solutions at electronica 2024.
SEMICON Japan 2024 to Expand Scope with Spotlight on Advanced Design Innovation
10/23/2024 | SEMISEMICON Japan 2024, the largest gathering of leaders from the microelectronics manufacturing supply chain in Japan, will assemble more than 1,000 exhibitors showcasing semiconductor solutions for smart technologies from Dec. 11-13 at Tokyo Big Sight.
IDC FutureScape: The AI Pivot Towards Becoming an AI-Fueled Business
10/21/2024 | IDCAccording to a recent research from International Data Corporation (IDC) entitled The Global Impact of Arti f icial Intelligence on the Economy and Jobs, AI will have a cumulative global economic impact of $19.9 trillion through 2030 and will drive 3.5% global GDP in 2030.
TRI Launches High-Speed 3D AXI for Semiconductor Applications
10/18/2024 | TRITest Research, Inc. (TRI), the leading provider of test and inspection systems for the electronics manufacturing industry, proudly announces the release of the high-throughput 3D SEMI CT AXI TR7600 SIII Plus, specifically designed for high-reliability electronics manufacturing, including the Semiconductor and Advanced Packaging industries.