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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
June 14, 2024 | Nolan Johnson, PCB007Estimated reading time: 2 minutes

This week’s must-reads are comprised of news which moves the industry forward. We’ve had quite a lot of news on a global scale, and they’re all good reads. To winnow down to just five, I chose either new information or interesting takes on ongoing industry stories. To that end, we have news about new capital equipment for advanced packaging, discussions of material selection and the imaging process during PCB fabrication, a columnist's ode to the best engineer she knows, and some optimistic news from the semiconductor industry.
ASMPT Combines High-speed Chip Assembly Directly from the Wafer with SMT Placement in a Single Machine
Published June 6
System in package (SiP) technology is not just a thing of the future. It’s here today and ASMPT has announced manufacturing equipment to support SiP. This new system “processes both SMDs from tapes and dies taken directly from the wafer in a single step at speeds of up to 50,000 dies or 76,000 SMT components per hour.” It might not become a mainstream manufacturing method in 2024, but it’s clear packages will be bypassed entirely for certain silicon die in the near future.
Overconstrain? Underconstrain? Selecting Materials for High-speed Designs
Published June 6
No matter the technical sophistication of your PCB design, the evolution of state-of-the-art packages continues to make materials selection a critical step in the design process. So, I-Connect007’s Andy Shaughnessy asked Stephen Chavez, principal technical product marketing manager at Siemens, to share his thoughts on material selection for high-speed designs. Steph discusses material constraints, stackups, and the cut-off point when a “traditional” laminate will (and won’t) work for a high-speed board.
ASC Sunstone Talks Imaging in Latest Podcast Episode
Published June 11
In the latest episode of the podcast series, On the Line With: Designing for Reality, I returned to Sunstone Circuits in Mulino, Oregon, to continue down the manufacturing process with Matt Stevenson.
This series is all about the specifics that can affect your circuit board during the manufacturing process and includes tips and tricks for optimizing design, fabrication, yields, and cost. In this episode, Matt paints a picture of the outer layer imaging process. Since each circuit board is a one-of-a-kind pattern of metal connections representing the specific design for that circuit, how do those unique features get mapped onto the board? Find out in Episode 7.
Global Semiconductor Sales Increase 15.8% YoY in April
Published June 7
This announcement from the Semiconductor Industry Association (SIA) was interesting enough to make my must-reads based on the numbers alone. But at the risk of spoiling the article, I found this passage most interesting: “SIA today endorsed the WSTS (World Semiconductor Trade Statistics organization) Spring 2024 global semiconductor sales forecast, which projects annual global sales will grow to $611.2 billion in 2024, which would be the industry’s highest-ever annual sales total.” Get all the numbers here.
The New Chapter: Lessons From the Best Engineer I’ve Ever Known
Published June 12
How did you get into this industry? Did you follow in a family member’s footsteps? As columnist Paige Fiet explains, her engineer father played a large part in her decision to become an engineer. In this column, Paige discusses the lessons she’s learned from her father—engineering and otherwise—that have shaped the way she looks at her job and the world.
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Akrometrix Announces Next Generation Thermal Warpage Measurement Tool the PS600T
09/05/2025 | Akrometrix LLCAkrometrix, LLC, the leading provider of Thermal Warpage and Strain Metrology Equipment for semiconductor and electronics industries, recently announced the next generation in thermal warpage metrology with its PS600T system.
Labor Day: U.S. Federal Holiday
09/01/2025 | Andy Shaughnessy, I-Connect007Today is Labor Day, a U.S. federal holiday that Americans celebrate on the first Monday of September each year. This marks the 131st anniversary of the holiday. In 1887, Oregon was the first state to make Labor Day an official holiday. In 1894, after the Pullman Strike, Congress passed a bill that recognized Labor Day as a federal holiday, and President Grover Cleveland signed the bill into law.
Datest Unveils Viscom iX7059 XL 3D CT AXI System
08/25/2025 | DatestDatest, a trusted leader in advanced testing, engineering, inspection, and failure analysis services, and the go-to destination for when your boards misbehave and your AXI line goes on vacation, is thrilled to announce the arrival of its newest diagnostic weapon: the Viscom iX7059 XL 3D CT AXI Inspection System.
Polar Instruments Announces Additive Transmission Line Support for Si9000e
08/20/2025 | Polar InstrumentsTransmission lines embedded into the PCB surface are a feature of UHDI constructions. The 2025 fall release of Polar's Si9000e PCB impedance & insertion loss transmission line field solver incorporates eight new single ended, differential and coplanar transmission line structures.
Axxon-Mycronic Brings High-Performance Conformal Coating to productronica India 2025
08/20/2025 | Axxon-MycronicAxxon-Mycronic, a leading, global supplier of innovative and production-ready, dispensing and conformal coating systems, is pleased to announce its participation in productronica India 2025, taking place September 17–19 at the Bangalore International Exhibition Centre (BIEC).