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Aerojet Rocketdyne Delivers 1,000th THAAD Solid Rocket Boost Motor and Divert and Attitude Control System Ahead of Schedule
June 14, 2024 | BUSINESS WIREEstimated reading time: 1 minute
Aerojet Rocketdyne, an L3Harris Technologies company, recently completed its 1,000th delivery of both the solid rocket boost motor and Liquid Divert and Attitude Control System (LDACS) for the Missile Defense Agency’s (MDA) Terminal High Altitude Area Defense (THAAD) system. The ahead-of-schedule delivery to Lockheed Martin demonstrates Aerojet Rocketdyne’s long-standing ability to provide trusted propulsion and precision systems for one of the nation’s primary defensive weapons against short, medium and intermediate-range missiles.
“The Aerojet Rocketdyne-powered THAAD serves a critical need for the military, safeguarding our nation, allies and infrastructure from would-be missile attacks from those who wish to do us harm,” said Ross Niebergall, President, Aerojet Rocketdyne, L3Harris. “Our focus remains on continued performance excellence to provide reliable propulsion our customers can count on.”
The THAAD weapon system is a land-based component of MDA’s Missile Defense System. Since production began, the combat-proven system has had a 100% success rate in missile defense tests — 16 intercepts in 16 tests. THAAD is the only U.S. system designed to intercept targets outside and inside the atmosphere.
Aerojet Rocketdyne’s Advanced Manufacturing Facility in Huntsville, Alabama, and its site in Camden, Arkansas, produce THAAD’s solid rocket boost motor. LDACS, the highly responsive thruster system, which keeps THAAD on target during the last stages of an intercept, is produced at the company’s facility in Los Angeles, California.
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Hanwha Aerospace to Collaborate with BAE Systems on Advanced Anti-jamming GPS for Guided Missiles
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EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).