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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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I-Connect007 Welcomes Dr. Cody Schoener as Newest Mil/Aero Columnist

11/09/2026 | I-Connect007
I-Connect007 is excited to welcome Dr. Cody Schoener of Dow as a new monthly columnist for our weekly Mil/Aero Newsletter. His column, Built to Survive, will explore the materials and technologies used to protect electronics in demanding military, aerospace, and aviation environments.

FSQuality in Thailand: From Automotive and Industrial Controls to AI and Optical Modules

11/05/2026 | Tulip Gu, ECIO and Marcy LaRont, I-Connect007
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FSQuality Circuits to Exhibit at electronica 2026 in Munich, Germany

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I-Connect007 Releases Episode 5 of ‘On the Line With… Qnity: Engineering What’s Next’ Podcast Series

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Delton Turns Its Thailand Location Into a Rules-driven Smart Factory

11/03/2026 | Tulip Gu, ECIO and Marcy LaRont, I-Connect007
On Sept. 1, 2026, ECIO’s Edy Yu and Tulip Gu, along with I-Connect007’s Marcy LaRont, toured Delton’s Thailand facility in Prachin Buri. The factory officially began production in June 2025 and, impressively, was profitable by December. Phase I capacity utilization has already exceeded 90%, and further expansion is moving quickly—a remarkably fast ramp-up for an overseas PCB operation.
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