Flexible Thinking: Designing Flex Circuits for Dynamic Reliability
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Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
It’s a holiday weekend in the United States, but the news doesn’t stop just because a few of us have the day off! You’ll have to pardon me; my ears are still ringing from the fireworks. Without further ado, here are the five things you should not miss from this week.
Convergence hangs in the air this week like the odor of spent gunpowder. SEMI has launched a med tech consortium to “revolutionize global healthcare”; Altium and Renesas have officially tied the knot; the technical details of material selection and fabrication process control are both under discussion; and iNEMI and IPC are collaborating on advocacy for circularity in the supply chain.
Wherever you are, enjoy this first weekend of July. And always, if you have something to say, please email me. If you try talking to me, I don’t think I’ll be able to hear you quite yet.
New SEMI Governing Council for Smart MedTech Initiative to Connect Semiconductor and Life Science Communities
Published July 2
The Smart MedTech initiative is an effort by SEMI to “revolutionize global healthcare through innovation, democratization, and pioneering advances in preventative care.” Spokespeople point out that this will shift health care from a provider-centric model to a personal care model. Some global names are attached to this initiative, and there could be some disruptive technology on display here in coming years.
Regulatory Review of Renesas’ Acquisition of Altium Concludes
Published July 2
With approval from the Committee on Foreign Investment in the United States (CFIUS) on July 1, the Renasas and Altium merger was complete. A very big deal in the PCB and greater system design realm, this merger sends another strong signal that IC and PCB design tools must/will move closer together functionally.
Don’t Overconstrain Your Board Materials
Published July 2
Kris Moyer and the I-Connect007 team engaged in a characteristically boisterous conversation on material constraints and where you now have more choices than has traditionally been the case. Moyer begins by reminding us all not to call this new family of materials “FR-4” and shares his reasons. Read it here to learn more.
The Chemical Connection: Chemical and Equipment Control of High-density Circuits
Published July 2
Selecting the right materials is an increasingly critical decision during PCB design, but on the fabrication side, there are ever-shrinking process windows to consider. Don Ball’s column gets specific and tactical about improved process control and optimization.
IPC/iNEMI Webinar on Circularity Challenges in Electronics Manufacturing
Published July 2
The truism, “there is no end to a circle” captures the importance and ongoing nature of developing supply chain circularity. If circularity is an initiative for your organization, then I encourage you to register for this collaborative webinar. Something be giving increasing importance, this webinar will help attendees learn new scopes of work, new industry standards and tools, and educational programs focused on supply chain circularity.
