-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueSilicon to Systems: From Soup to Nuts
This month, we asked our expert contributors to weigh in on silicon to systems—what it means to PCB designers and design engineers, EDA companies, and the rest of the PCB supply chain... from soup to nuts.
Cost Drivers
In this month’s issue of Design007 Magazine, our expert contributors explain the impact of cost drivers on PCB designs and the need to consider a design budget. They discuss the myriad design cycle cost adders—hidden and not so hidden—and ways to add value.
Mechatronics
Our expert contributors discuss the advent of mechatronics in PCB design, the challenges and opportunities this creates for circuit board designers, and the benefits—to the employee and the company—of becoming a mechatronics engineer.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
Letter of Urgency to the PCB Industry Gets Massive Response
July 9, 2024 | EIPCEstimated reading time: 1 minute
The EIPC have received overwhelming support for our Letter of Urgency calling for assistance to the European PCB industry. We believe that to maintain viability our European PCB industry requires support in both capacity and capability otherwise we risk falling beneath critical mass and failing to take advantage of opportunities arising from new technologies utilising complex high density interconnection systems. The list of respondents is attached.
EIPC now invite the members of the European PCB industry to assist them by forwarding the signed letter to local, regional and national politicians with the following calls to action:
The EIPC are calling for explicit assistance to the European PCB industry, including but not limited to direct financial aid, access to internationally competitive energy pricing, facilitating bank guarantees in support of capital expenditure, favourable loans, and tax breaks.
The EIPC wants to raise awareness of the vital role played by PCBs in supplying the European defence and aerospace sectors. We request that preference be given to local procurement of PCBs to Original Equipment Manufacturers (OEMs), especially in high-end and high reliability applications and emphasise that PCB functionality and reliability requires close interaction between designer and manufacturer.
The EIPC are calling for the EU to remove punitive tariffs on imported raw material that disadvantage domestic production and encourage the importation of higher value PCBs from outside of the EU.
The EIPC are calling for the establishment of a holistic roadmap with associated R&D funds for improved capability and capacity, focussing on the European electronics manufacturing ecosystem. This includes opportunities for strengthening high-end technologies required to support the requirements of new technologies utilising complex high density interconnection systems.”
Please get in touch with the EIPC if you want to get more involved or need more details.
Suggested Items
ESMC Breaks Ground on Dresden Fab
08/20/2024 | TSMCESMC – a joint venture between TSMC, Robert Bosch GmbH, Infineon Technologies AG and NXP Semiconductors N.V. –held a groundbreaking ceremony to officially mark the initial phase of land preparation for its first semiconductor fab in Dresden, Germany.
MilDef to Deliver Rugged Displays to European Military Vehicle Manufacturer
08/14/2024 | CisionVia the acquisition of certain assets of Advanced Vision Technologies Ltd (AVT), MilDef has now been entrusted to deliver intelligent and rugged displays to key European land vehicle programmes.
NSPA awards RTX's Raytheon a $478 million Patriot GEM-T missile contract
08/06/2024 | RTXRaytheon, an RTX (NYSE: RTX) business, was awarded a $478 million contract from the NATO Support and Procurement Agency (NSPA) to supply additional GEM-T missiles to Germany. This contract supports the replenishment of Patriot missiles donated by Germany to Ukraine. Showing their strong support for Ukraine, Denmark, the Netherlands and Norway have agreed to participate in the financing of this procurement.
SEMI EuroPAT Workshop to Highlight the Future of Semiconductor Packaging Manufacturing in Europe
08/06/2024 | SEMIThe EuroPAT Workshop, an annual event of the SEMI Integrated Packaging Assembly & Testing European Chapter Technology Community (ESiPAT-TC), taking place from 9-10 September, 2024 in Berlin, will feature manufacturing and supply chain trends for semiconductor packaging, assembly, and test in Europe.
SEMI Publishes Recommendations on Outbound Investments in Response to European Economic Security Strategy
07/31/2024 | SEMISEMI, the industry association serving the global electronics design and manufacturing supply chain, today published recommendations to advance the European semiconductor industry in response to the European Economic Security Strategy.