-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueCounterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
A Culture of Thriving
One cannot simply command thriving; it must be nurtured, developed, and encouraged. In this issue, we explore strategies to improve your working relationship model—both internally and externally. In this culture of thriving, your business will grow in the process.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Indium Corporation Introduces Au-Based Precision Die-Attach Preforms
July 17, 2024 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation® is proud to introduce new, high-reliability Au-based Precision Die-Attach (PDA) Preforms. Compared to standard preforms, these gold-based PDA preforms offer a higher level of precision to reduce defects, control bondline thickness (BLT), and deliver high-yield performance and reliability in critical die-attach applications.
Semiconductor laser die-attach applications require the highest quality, ultra-precise solder preforms to ensure accuracy and repeatability during assembly for a guaranteed, highly reliable end product. Indium Corporation’s Au-based PDA Preforms offer the new gold standard. Features include:
- Highly accurate thickness control
- Precise edge quality
- Optimized cleanliness
- Default waffle pack method
- Available for gold-based alloys
“We are excited to offer our gold-based PDA preforms because they are able to uniquely meet our customers’ needs for highly automated, precision processes,” said Indium Corporation Senior Product Manager Jeff Anweiler. “They not only reduce solder-related defects and die-tilt, but they also increase process yield performance. These products deliver superior thermal transfer, operational efficiency, and device reliability, especially for critical laser and RF applications, as well as 5G communications.”
Indium Corporation’s Au-based PDA Preforms are available in the following alloys:
- Primary alloys:
- 80Au/20Sn
- 79Au/21Sn
- Development alloys:
- 78Au/22Sn; 77Au/23Sn; 76Au/24Sn; 75Au/25Sn
- 88Au/12Ge
- 96.8Au/3.2Si
- 82Au/18In
Selecting the right preform characteristics and packaging is crucial for consistent success in production processes. Every application has unique parameters, making it essential to design a preform and its packaging to meet these specific needs.
Suggested Items
Indium to Feature Precision Gold-Based Die-Attach Preforms at International Microwave Symposium
06/05/2024 | Indium CorporationIndium Corporation® will feature its high-reliability, gold-based precision die-attach (PDA) preforms for critical laser and RF applications, as well as 5G communications, at the International Microwave Symposium, Washington, D.C., June 18-20.
TANAKA Establishes Bonding Technology for High-Density Semiconductor Mounting Using AuRoFUSE Preforms
03/12/2024 | JCN NewswireTANAKA Kikinzoku Kogyo K.K., which develops industrial precious metals products as one of the core companies of TANAKA Precious Metals, announced that it has established a gold particle bonding technology for high-density mounting of semiconductors using AuRoFUSE™ low-temperature fired paste for gold-to-gold bonding.
Indium to Feature Precision Au-Based Die-Attach Preforms at SPIE Photonics West
01/12/2024 | Indium CorporationIndium Corporation® will feature its high-reliability, Au-based precision die-attach (PDA) preforms for critical laser and RF applications at SPIE Photonics West, Jan. 27-Feb. 1, in San Francisco.
Indium Corporation Earns IEEE Outstanding Industry Award for Innovative Solder Preforms
07/06/2023 | Indium CorporationIndium Corporation has earned the IEEE Malaysia Section Outstanding Industry Award (Innovation) for its InFORMS® brand of reinforced solder preforms. The award was presented during a ceremony on June 24 in Kuala Lumpur, Malaysia.
Indium Corporation to Present at International Microwave Symposium
04/29/2022 | Indium CorporationOne of the most highly demanded applications for 80Au/20Sn is semiconductor laser die-attach due to recent advancements that have made lasers an economical option for a multitude of new products.