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Tom Edman Leads IPC Board of Directors
July 17, 2024 | Marcy LaRont, PCB007 MagazineEstimated reading time: 2 minutes

IPC elected several new board members at IPC APEX EXPO in April, including new Board Chair Tom Edman, CEO of TTM, who assumes the role from Bob Neves, CTO and chair of Microtek Laboratories. Tom and TTM have long been active in many facets of IPC. I caught up with Tom and asked him about his new board appointment, IPC, and the industry he serves. He emphasizes IPC’s work in standards and advocacy as especially important for our industry.
Tom, from your perspective, what does it mean to chair the IPC Board? What is your role, and how long is your term?
My term is for two years. I am thrilled to be chair at this exciting time with IPC as the organization continues its work on behalf of electronics manufacturers. The vision for the organization will continue to allow IPC to build on its foundation of standards development while strengthening key areas such as workforce development, policy representation, sustainability, and design.
Why is involvement in IPC important for industry companies? What would you tell someone who may be considering membership?
I would explain the critical role that IPC plays in representing our industry and the direct help that IPC provides with critical industry standards, training materials, funding opportunities, policy support, and networking opportunities, among other benefits, all with a competitive dues structure. The breadth of IPC’s global capabilities is astounding to me and has served to benefit TTM as well as so many other electronics manufacturers.
As a leader and ambassador for IPC over these next two years, what are your goals?
Frankly, my goal is to aid John Mitchell and the other executives at IPC in implementing a growth strategy that is truly impressive. John and the team have the support of an engaged and energetic board in realizing their goals. We just need to support these goals in any way possible.
What advice do you have from a leadership and strategy standpoint for small business owners who may be trying to decide whether to participate in the next evolution of PCB fabrication?
I would suggest that we all have a role to play in supporting our customers. As our customers move to new designs that require increased capabilities, I believe that everyone in the industry will benefit by investing strategically in capabilities that enhance their growth. New designs will coexist with older designs, which, hopefully, will offer all of us profitable opportunities.
This conversation appeared in the June 2024 issue of PCB007 Magazine.
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Julia McCaffrey - NCAB GroupSuggested Items
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10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
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