Beyond Design: AI-driven Inverse Stackup Optimization
Global PCB Connections: Following DFM Rules Leads to Better Boards
Elementary Mr. Watson: How to Reinvent Your Professional Journey
Innovative and Cost-effective BGA Re-balling
July 23, 2024 | Shavi Spinzi, Nano Dimension/EssemtecEstimated reading time: Less than a minute
A new, high-quality BGA re-balling process, which is integrated into an all-in-one solution of dispensing and placement equipment developed by Essemtec, brings new opportunities for the reapplication of expensive BGA components. This new method seamlessly integrates the sequence of flux deposition and ball (sphere) placement with the subsequent soldering process.
In this article, we explore the challenges, solutions, and impact on assembly with large BGA devices and propose a new technique appropriate for many electronics segments, including military, aerospace, computing, and communication.
The Need for BGA Re-balling
There are several reasons for BGA re-balling, including economic, technological, reliability, sustainability, and specific industry requirements.
To read this entire article, which appeared in the July 2024 issue of SMT007 Magazine, click here.
Share on:
Suggested Items
Altus Group Introduces Innovative BGA Reballing Solution to Meet Growing Sustainability Demands
09/25/2024 | Altus GroupAltus Group, a leading distributor of capital equipment in the UK and Ireland, has introduced an advanced BGA re-balling solution to address the electronics industry's growing focus on sustainability and cost-efficiency.
INSPECTIS’ Extended Reach BGA-XL Stand for Larger PCBAs Joins Higher Magnification XM Lenses
09/23/2024 | INSPECTISUltra-low clearance BGAs on large PCBAs are no problem to optically inspect now, because INSPECTIS’ BGA-XL stand will reach them, while optional new XM lenses will get you under them – offering up to 285x screen magnification.
Beyond Design: Integrated Circuit to PCB Integration
09/11/2024 | Barry Olney -- Column: Beyond DesignTechnologies such as artificial intelligence, autonomous cars, smartphones, and wearable devices are significantly transforming the semiconductor industry. The miniaturization trend drives the IC footprint to an even smaller profile, requiring tighter margins. From the PCB designer’s perspective, smaller form factors are achievable, making devices more compact and lightweight. But double-sided SMT placement, reduced routing channels, and high-speed constraints create multiple challenges for designers. However, there are some advantages to miniaturization: shorter interconnects between the IC and the PCB reduce signal loss and electromagnetic interference. High-speed digital signals in the GHz range benefit from reduced parasitics.
Cost-optimize Your PCB Design and Specifications
08/20/2024 | Erik Pedersen and Richard Koensgen, ICAPE GroupKnowledge is the key to identifying the small details that makes the big cost difference for your printed circuit board. There are many types of printed circuit boards and multiple choices between the development of schematic and BOM to PCB technology selection, electronic PCB design, mechanical and physical properties, and PCB specification.
Reliability Comparisons of FPBGA Assemblies Under Hot/Cold Biased Thermal Cycle
08/06/2024 | Thomas Sanders, Seth Gordon, Reza Ghaffarian, Jet Propulsion LaboratoryCurrent trends in microelectronic packaging technologies continue in the direction of smaller, lighter, and higher density packages. The telecommunications industry and particularly mobile/portable devices have a strong need for lighter and smaller products. The current emerging advanced packaging (AP) technologies, including system-in-package (SiP) and 2.5D/3D stacked packaging, added another level of complexity and challenges for implementation.