-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueSignal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
Showing Some Constraint
A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
ULT Introduce New Extraction Solution for Combustible and Carcinogenic Laser Dusts
August 6, 2024 | ULT AGEstimated reading time: 1 minute

ULT is introducing the LAS 260 H/Ex, a new solution for removing critical dust during various laser processes. The explosion-proof device was developed for extracting and filtering dry, combustible, and health-endangering pollutants (dust and fumes) that can arise during laser processing of plastics and metals.
As an ATEX-compliant system designed to be free of ignition sources, the LAS 260 H/Ex is suitable for installation and operation within a zone 22 and enables the safe separation of combustible dust. Even the finest particles are separated to 99.995% in a two-stage filter system including a HEPA H-14 filter and safety filter stage.
The safety filter with integrated activated carbon filling ensures the safe operation of the device and removes gases that are hazardous to health and unpleasant odors. Due to the high level of cleaning, the filtered clean gas can be fed back into the work area even when carcinogenic, mutagenic, or toxic dust is separated (recirculation mode).
In addition to the redundant filter system, the LAS 260 H/Ex provides further user benefits such as high flexibility through mobile utilization, extremely quiet operation, and low energy consumption.
All electrical components are suitable for UL and CE compliant use. In addition, the device can be used worldwide with a voltage range of 110-240 V.
To ensure compliance with the minimum volume flow of >20 m/s, an automatic monitoring system is integrated, which issues a warning signal if the flow falls below this limit.
A collection element (hose, pipe, extraction arm) with DN50 can be connected to the extraction and filter system. In addition, an M12 i
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/12/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest On the Line With... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
KYZEN to Feature High-Reliability MICRONOX Chemistries at IMAPS Symposium
09/10/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is pleased to announce its participation at the International Symposium on Microelectronics or IMAPS Symposium, taking place September 29-October 3 at Town & Country Resort in San Diego, CA.