-
-
News
News Highlights
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueSilicon to Systems: From Soup to Nuts
This month, we asked our expert contributors to weigh in on silicon to systems—what it means to PCB designers and design engineers, EDA companies, and the rest of the PCB supply chain... from soup to nuts.
Cost Drivers
In this month’s issue of Design007 Magazine, our expert contributors explain the impact of cost drivers on PCB designs and the need to consider a design budget. They discuss the myriad design cycle cost adders—hidden and not so hidden—and ways to add value.
Mechatronics
Our expert contributors discuss the advent of mechatronics in PCB design, the challenges and opportunities this creates for circuit board designers, and the benefits—to the employee and the company—of becoming a mechatronics engineer.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
TRI to Display New Wafer Inspection and Metrology Solution
August 6, 2024 | TRIEstimated reading time: 1 minute
Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join SEMICON Taiwan held at Taipei Nangang Exhibition Center, Hall 1 – 4F from September 4 - 6, 2024. OmniMeasure, TRI's SEMI inspection partner, will be joining TRI's booth #N0990.
Visit TRI's booth to learn more about AI-powered AOI solutions for the Semiconductor and Advanced Packaging Industry. TRI has SEMI Inspection solutions for Advanced WLP/PLP and SEMI Back-End Package processes.
TRI will be exhibiting the new Wafer Inspection Platform, TR7950Q SII, featuring a 25MP camera with 2.5 μm resolution and a 12MP camera with 0.55um microlens for high-resolution 2D/3D DFF inspection and AI-powered inspection algorithms. The TR7950Q SII is suitable for the Wafer Macroscopic 3D Inspection and micro measurement metrology. The TR7950Q SII can inspect Advanced WLP, Wafer Frame, Patterned Wafer, Wafer Bumping, WLCSP, through-silicon via (TSV), and more. The TR7950Q SII can inspect TSV at ultra-high speeds thanks to the TSV module from OmniMeasure. TSV Metrology functions: sensing TSV depth, trench depth, oxide, nitride, PR, and PI film thickness.
TRI will also showcase the latest back-end inspection solutions, TR7007Q SII-S and TR7700Q SII-S. The TR7007Q SII-S can inspect Mini-LED, C4 bumps (~100 μm Ø), and 008004 paste inspection applications. The AI-powered 3D SEMI AOI, TR7700Q SII-S, can inspect die, wire diameters of up to 15 μm (0.6 mil), SiP, underfill, bumps, and more. The lineup will also include an X-ray Inspection Demo Station. TRI's SEMI AXI solutions can inspect C4 bumps and Cu pillars.
OmniMeasure will display the TGV (Through Glass Via) 3D Viewer, a TGV metrology tool that employs non-contact tomography measurement to view cross-sections of the glass via easily. The TGV viewer can also measure side wall angles without needing SEM.
Visit TRI's Booth No. N0990 at SEMICON Taiwan 2024 to learn more about TRI's SEMI applications and the latest inspection innovations for the Semiconductor and Advanced Packaging Industry.
Suggested Items
ViTrox Showcases Cutting-Edge VisionXpert Smart Code Readers at SMTA Penang 2024
09/17/2024 | ViTroxViTrox, which aims to be the World’s Most Trusted Technology Company, is excited to announce its participation in the SMTA Penang at Table #37 in the AC Hotel, Penang on 25-26 September 2024.
MEK Launches New PowerSpector JSAz 550: Larger 3D Desktop AOI System with New Chassis
09/11/2024 | MEKMek (Marantz Electronics), a leader in Automated Optical Inspection (AOI) and Solder Paste Inspection (SPI) technology, proudly announces the launch of its latest product, the PowerSpector JSAz 550. This new selective 3D desktop AOI system is a larger L-size model, capable of accommodating Printed Circuit Boards (PCBs) up to 550x550mm (21.7”x21.7”).
Zero Defects International to Exhibit at Utah Expo and Tech Forum
09/04/2024 | Zero Defects InternationalZero Defects International [ZDI] has announced their participation as an exhibitor at the SMTA Utah Expo and Tech Forum. It will be held at the Salt Lake City Marriott University Park.
Saki to Showcase Cutting-Edge Total Inspection Line Solutions at Productronica India 2024
08/28/2024 | Saki CorporationSaki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, is pleased to announce its participation at productronica India 2024, one of the premier trade events for the electronics manufacturing industry in the region.
TRI’s High-Performance Inspection Solutions at SMTAI 2024
08/27/2024 | TRITest Research, Inc. (TRI) is joining the upcoming SMTA International Exposition & Conference on October 22 – 24, 2024, at the Donald E. Stephens Convention Center, Rosemont, IL, USA.