Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
It’s Only Common Sense: Selling During an Economic Downturn
Marcy’s Musings: Can You Hear the Voices?
SEMI EuroPAT Workshop to Highlight the Future of Semiconductor Packaging Manufacturing in Europe
August 6, 2024 | SEMIEstimated reading time: 1 minute
The EuroPAT Workshop, an annual event of the SEMI Integrated Packaging Assembly & Testing European Chapter Technology Community (ESiPAT-TC), taking place from 9-10 September, 2024 in Berlin, will feature manufacturing and supply chain trends for semiconductor packaging, assembly, and test in Europe. Themed Semiconductor Packaging Manufacturing in Europe – Growing or Vanishing? , the third edition of the workshop will showcase collaboration among Outsourced Semiconductor Assembly and Test (OSAT) providers and Semiconductor Packaging, Assembly, and Test Service Providers (SPAT-SPs) that is instrumental for the resilience of Europe’s microelectronics industry. Registration is open.
SEMIAs the complexity of semiconductor technologies increases, collaborative Chip-Package-Board-System co-design is becoming a focal point for Integrated Device Manufacturers (IDMs) and Original Equipment Manufacturers (OEMs). Workshop attendees will deep dive into this complex framework and explore the future of electronics packaging, assembly, and test. Additionally, the workshop will disseminate results of the Pack4EU, a European funded project assessing the current status and evolving needs of packaging, assembly, and test in Europe.
"SEMI Europe looks forward to welcoming leading packaging, assembly and test experts to the EuroPAT Workshop in Berlin," said Laith Altimime, President of SEMI Europe. “The exceptional lineup of speakers will offer insights into vital trends for semiconductor packaging manufacturing.”
This year’s EuroPAT Workshop will be hosted by Swissbit Germany AG on day one and the Mercure Hotel MOA on day two. The workshop will present a broad scope of topics including:
- Packaging, assembly and test manufacturing in Europe
- The role of European OSATs and SPAT-SPs
- Semiconductor packaging supply chain
- EU Chips Act updates for packaging
- Coordination and Support Action (CSA) and Pack4EU Chips Joint Undertaking (Chips JU) updates
- European markets and applications strengths and weaknesses
- Technology transfer from pilot lines in RTO and industrial pilot lines
- Collaboration in open advanced packaging piloting facilities
Share on:
Suggested Items
The Future of Advanced Packaging Inspection Is X-ray
04/22/2025 | David Kruidhof and Kevin Jan, Comet YxlonDriven by smartphones, high-performance computers, and artificial intelligence, the global demand for high-end computing power is constantly rising. The industry is also facing demands for miniaturization, which creates the need for ever-smaller defect recognition. The semiconductor industry has been identifying and solving these challenges for decades using various optical inspection and SEM tools.
Navigating Robotics Deployment Challenges with SINBON
04/18/2025 | PRNewswireIn spite of the potential for robotics technology to expand productivity, several implementation challenges continue to stand in the way of more widespread adoption.
University of Arizona Pioneering Technical Education Beyond Semiconductors
04/18/2025 | Marcy LaRont, PCB007 MagazineWhile many universities struggle to keep their curriculum up to date with the evolving needs of the electronics industry, the University of Arizona stands head and shoulders above the others. Its Center for Semiconductor Manufacturing incorporates five of the colleges at UA and emphasizes an interdisciplinary approach to prepare students for diverse careers in technology and manufacturing.
Test Research, Inc. Honored with ASE Outstanding Supplier Award for 2024
04/15/2025 | TRITest Research, Inc., is proud to announce that it has been recognized with the Outstanding Supplier Award from ASE Technology Holding Co., Ltd.
IPC APEX EXPO Special Sessions: A Focus on Advanced Electronic Packaging
04/09/2025 | Tracy Riggan, IPCThe IPC Technology Solutions team hosted two special sessions on Thursday, March 20 at IPC APEX EXPO 2025 focused on advanced electronic packaging. The first session focused on AI/data center applications and the second on power electronics applications. The day kicked off with opening remarks on strategic direction of IPC in the area of advanced electronic packaging from Matt Kelly, IPC CTO, and an overview of the current landscape of component and system level packaging by Devan Iyer, PhD, IPC chief strategist, advanced packaging.