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This month, we asked our expert contributors to weigh in on silicon to systems—what it means to PCB designers and design engineers, EDA companies, and the rest of the PCB supply chain... from soup to nuts.
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In this month’s issue of Design007 Magazine, our expert contributors explain the impact of cost drivers on PCB designs and the need to consider a design budget. They discuss the myriad design cycle cost adders—hidden and not so hidden—and ways to add value.
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Our expert contributors discuss the advent of mechatronics in PCB design, the challenges and opportunities this creates for circuit board designers, and the benefits—to the employee and the company—of becoming a mechatronics engineer.
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Real Time with… THECA 2024: State of the Art Copper Adhesion
August 9, 2024 | Real Time with... THECAEstimated reading time: Less than a minute
Bruce Lee, MacDermid Alpha Electronics Solutions, joined Nolan Johnson following his paper presentation on the show's mainstage. Lee provided a detailed overview of the current state of adhesion promoters and discussed the interaction between mechanical adhesion, chemical adhesion, signal integrity, and substrate impacts. Watch the interview now.
For our full coverage of THECA 2024, visit the Real Time with... THECA 2024 site.
Suggested Items
Atotech to Participate at KPCA Show 2024
09/03/2024 | AtotechMKS’ Atotech will participate in this year’s KPCA Show 2024 in Incheon, held at Songdo Convensia from September 4-6, 2024.
MKS’ Atotech to Participate at Semicon Europa 2022
11/02/2022 | AtotechMKS’ Atotech will be exhibiting at Semicon Europa and present its latest results on Cu-to-Cu direct bonding for 3D integration during Advanced Packaging Solutions Conference (APC) in Munich on November 16 from 11:50 a.m. – 12:10 p.m. (room 14c; presenter: Ralf Schmidt, R&D Manager Semiconductor).
Trouble in Your Tank: Success in Photolithography Starts With Surface Preparation
11/09/2022 | Michael Carano -- Column: Trouble in Your TankThe photolithography process defines the circuitry on the panel. As one may surmise, the imaging process used in the fabrication of high density and ultra high-density circuity has made significant advances over the last decade—and just in time. With finer lines and spaces as well as more attention to fabrication of printed wiring advanced packaging substrates. However, as is so true of many of the processes in PWB fabrication, up and down stream processes can and will influence what happens in a particular process.
MacDermid Alpha Launches ALPHA HiTech AD13-9910B Ultra-Low Temperature Adhesive
08/11/2022 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions, announces the launch of ALPHA HiTech AD13-9910B ultra-low temperature adhesive, designed to mitigate defects on very temperature sensitive parts and substrates.
EIPC Summer Conference 2022: Day 2 Review
06/29/2022 | Pete Starkey, I-Connect007Örebro, Sweden on June 15 brought a bright and early start to Day 2 of the EIPC Summer Conference for those who had enjoyed the previous evening’s networking dinner, but had resisted the temptation to over-indulge or to carry on their long-awaited catch-up conversations with old friends into the small hours. All but a few were in their seats for 9 a.m., awake and attentive for Session 4 of the conference, on the theme of new process technologies, moderated by Martyn Gaudion, CEO of Polar Instruments.