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The Chemical Connection: Surface Finishes for PCBs

03/31/2025 | Don Ball -- Column: The Chemical Connection
Writing about surface finishes brings a feeling of nostalgia. You see, one of my first jobs in the industry was providing technical support for surface cleaning processes and finishes to enhance dry film adhesion to copper surfaces. I’d like to take this opportunity to revisit the basics, indulge in my nostalgia, and perhaps provide some insight into why we do things the way we do them in the here and now.

PCB007 Magazine: The Essential Guide to Surface Finishes—March 2025

03/17/2025 | I-Connect007 Editorial Team
In the March 2025 issue of PCB007 Magazine, we go back to basics, recount a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. 

Unlocking Advanced Circuitry Through Liquid Metal Ink

10/31/2024 | I-Connect007 Editorial Team
PCB UHDI technologist John Johnson of American Standard Circuits discusses the evolving landscape of electronics manufacturing and the critical role of innovation, specifically liquid metal ink technology, as an alternate process to traditional metallization in PCB fabrication to achieve ever finer features and tighter tolerances. The discussion highlights the benefits of reliability, efficiency, and yields as a tradeoff to any increased cost to run the process. As this technology becomes better understood and accepted, even sought out by customers and designers, John says there is a move toward mainstream incorporation.

Atotech to Participate at KPCA Show 2024

09/03/2024 | Atotech
MKS’ Atotech will participate in this year’s KPCA Show 2024 in Incheon, held at Songdo Convensia from September 4-6, 2024.

MKS’ Atotech to Participate at Semicon Europa 2022

11/02/2022 | Atotech
MKS’ Atotech will be exhibiting at Semicon Europa and present its latest results on Cu-to-Cu direct bonding for 3D integration during Advanced Packaging Solutions Conference (APC) in Munich on November 16 from 11:50 a.m. – 12:10 p.m. (room 14c; presenter: Ralf Schmidt, R&D Manager Semiconductor).
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