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This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
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August Design007 Magazine: PCB Design Cost Drivers
August 8, 2024 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
Because 70 percent of the manufacturing costs of a product are determined in the design cycle, every decision a designer makes has some effect–good or bad–on the manufacturing cost, as well as the cost of the final product.
Fortunately, cost adders can be kept at bay: Designers can employ hundreds of tips, tricks, and techniques to keep costs down.
In this month’s issue of Design007 Magazine, our expert contributors explain the impact of cost drivers on PCB designs and the need to consider a design budget. They discuss the myriad design cycle cost adders—hidden and not so hidden—and ways to add value. When every decision has ramifications downstream, the more you know, the better.
Suggested Items
Northrop Grumman Launches Black Dagger Target to Test New Patriot Missile System Sensor
12/20/2024 | Northrop GrummanNorthrop Grumman Corporation launched a Zombie target vehicle variation, known as “Black Dagger,” from Fort Wingate to White Sands Missile Range, New Mexico, for the U.S. Army Space and Missile Defense Command’s (USASMDC) LTZ-3 test mission. Zombie targets get their name because they bring “new life” to demilitarized solid rocket motors by repurposing them to create threat-representative tactical ballistic missiles.
High-Generation Panel Production Expected to Drive OLED Notebook Penetration Rate Past 5% by 2027
12/20/2024 | TrendForceTrendForce's latest OLED Technology and Market Development Report reveals that the penetration rate of OLED displays in notebooks is set to increase to 3% in 2024, driven by large-scale procurement from Chinese laptop brands. While growth in 2025 is expected to be moderate, the anticipated introduction of OLED displays in Apple’s MacBook lineup will mark a significant turning point.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Dan’s Biz Bookshelf: ‘Costovation: Innovation That Gives Your Customers Exactly What They Want—And Nothing More’
12/25/2024 | Dan Beaulieu -- Column: Dan's Biz Bookshelf"Costovation" by Stephen Wunker and Jennifer Luo Law delivers a refreshing perspective on innovation by focusing on "just enough" innovation—creating products and services that serve the customer's needs without unnecessary features or costs. This book is a revelation for business leaders seeking effective strategies when flashy, expensive innovations often dominate the market. The authors share how companies can thrive by delivering targeted, cost-effective innovation by offering customers precisely what they need.
Are Our Stackup Rules No Longer Valid?
12/19/2024 | Cherie Litson, EPTAC MIT CID/CID+Are the stackup rules we used to follow no longer valid? It depends on what you’re designing. Electrical rules change depending on your circuit. Fabrication rules change depending on which fabricator you’re working with. Today, we just have more options, and sometimes, cost is a bigger rule than anything else. If you search online for information about layer stackups, trace widths, and hole sizes in PCBs, you’ll find a variety of resources.