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In this month’s issue of Design007 Magazine, our expert contributors explain the impact of cost drivers on PCB designs and the need to consider a design budget. They discuss the myriad design cycle cost adders—hidden and not so hidden—and ways to add value.
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August Design007 Magazine: PCB Design Cost Drivers
August 8, 2024 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
Because 70 percent of the manufacturing costs of a product are determined in the design cycle, every decision a designer makes has some effect–good or bad–on the manufacturing cost, as well as the cost of the final product.
Fortunately, cost adders can be kept at bay: Designers can employ hundreds of tips, tricks, and techniques to keep costs down.
In this month’s issue of Design007 Magazine, our expert contributors explain the impact of cost drivers on PCB designs and the need to consider a design budget. They discuss the myriad design cycle cost adders—hidden and not so hidden—and ways to add value. When every decision has ramifications downstream, the more you know, the better.
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Hidden Cost Drivers in PCB Design
09/05/2024 | Cherie Litson, CID+, Litson1 ConsultingI recently taught a CID+ course, and if you’ve ever taken a CID or CID+ course, you know that we discuss cost adders quite a bit. When I asked the class of 15 design engineers their ideas on the biggest cost adders, the first and strongest response: the project manager. Are you surprised by their answer? After over 40 years in the industry, I wasn’t. If you step back and look at the process of product development, you’ll see that many decisions that affect costs down the line really do take root with the project manager.
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Quiet Power: An Evolution in PCB Design Costs
09/04/2024 | Istvan Novak -- Column: Quiet PowerIn this column, I want to cover my experiences, particularly where costs are concerned, with printed circuit boards from the 1960s to the present day. I grew up in an apartment building in downtown Budapest, where I began doing hobby projects building circuits from our kitchen table. Now, I’m lecturing about the most recent advances in signal integrity at Oxford University. We’ve come a long way. Over the decades, new technologies allowed users to have more layers, lower-loss dielectrics, fine-pitch surface connections, blind and buried vias, and HDI and HDI+ board constructions that allow us to design higher-performing systems. I expect this trend to continue.