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HENSOLDT, Lockheed Martin Sign a Memorandum of Understanding

11/12/2024 | Lockheed Martin
On 7 November 2024, Oliver Dörre, CEO of HENSOLDT AG and Paul Lemmo, vice president and general manager Integrated Warfare Systems and Sensors at Lockheed Martin, signed a Memorandum of Understanding on a potential cooperation in the field of maritime command and control systems and radar technologies.

Renesas Jointly Developed World-Class '8-in-1' Proof of Concept with Nidec

11/12/2024 | Renesas
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today announced the world's first “8-in-1” proof of concept* (PoC) for E-Axle systems for electric vehicles (EV), which controls eight functions using a single microcontroller (MCU).

Agileo Automation Launches E84 PIO Box at SEMICON Europa

11/12/2024 | Agileo Automation
Agileo Automation, a leading provider of control and connectivity solutions for global semiconductor equipment manufacturers, today launches the E84 PIO Box at Booth #C2848.

DARPA Taps RTX to Strengthen Cyber Resiliency

11/11/2024 | RTX
RTX's BBN Technologies was awarded a contract to support DARPA's Compartmentalization and Privilege Management, or CPM, program. The CPM program aims to enhance cyber resilience by automatically subdividing software systems into smaller, secure compartments, preventing initial breaches from escalating into successful cyberattacks while maintaining system efficiency.

Meeting in Vienna: PCB Designers Invited to Engage in the Silicon to Systems Process

11/08/2024 | Michelle Te, IPC Community
PCB designers interested in innovative ideas, technical prowess, relevance, quality, and doing their best work can now register for the inaugural Pan-European Electronics Design Conference (PEDC), Jan. 29-30, 2025, in Vienna, Austria.
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