-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueDesigning Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
Training New Designers
Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
January 31, 2025 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes

The year is off to a roaring start across the globe, but especially in the U.S. We’ll all be carefully watching the changes in policy, legislation, and enforcement coming out of Washington D.C., in the coming weeks and months. One thing is clear, though. No matter what your opinions or political affiliations are, things will change.
That said, it is impossible to look at last week’s news and draw any conclusions about how everything will equilibrate in the end. Frankly, it’s just too soon for that sort of analysis. In the meantime, here are last week’s five top stories. If you’ve read nothing else about the industry this week, read these.
Flexible PCB Market Size Projected to Reach $50.90 Billion by 2030
Published January 27
Business Wire reports, “The global flexible printed circuit boards market size is projected to reach USD 50.90 billion by 2030, expanding at a CAGR of 13.7% from 2025 to 2030.” Why? They suggest that “tegulated demand from the IT and telecom sector in view of growing need for circuits with higher data processing speed and higher working temperature is further augmenting the growth.” Read more here.
GlobalFoundries Announces New York Advanced Packaging and Photonics Center
Published January 24
Plans to create a new center for packaging and testing are supported by investments from the State of New York and the Department of Commerce. The intent is to provide packaging capabilities for U.S.-made essential chips. This development is where supply chain and national security overlap. Read the details here.
The Test Connection, Inc. Launches The Training Connection to Address Critical Test Engineering and Development Needs
Published January 24
Responding to the critical need to train skilled workers, The Test Connection has launched The Training Connection. Focusing on critical methodologies such as Design for Test (DFT) and IPC standards, The Training Connection posits that it is poised to empower professionals with the tools and expertise they need to excel.
Connect the Dots: Designing for Reality—Surface Finish
Published January 29
If you haven’t been following the “On The Line With…” podcast series with ASC/Sunstone’s Matt Stevenson, you should. Matt’s easily digestible explanations for each PCB fabrication process step will help you understand how all the various steps connect to deliver your printed circuit board. In this episode, Matt discusses surface finishes. Give it a listen.
SMTA Expands Access to All Online Training Courses for Members
Published January 27
The announcement says it best: “During its final meeting of 2024, the SMTA Board of Directors approved a proposal to include all online training courses for active members. This initiative aims to add substantial value to SMTA membership and streamline access to essential training resources. Members can now effortlessly sign in to order courses which will be immediately available to access in their SMTA Classroom.” Membership has its advantages. Read more about this in the February 2025 issue of SMT007 Magazine, which publishes next week.
Suggested Items
EIPC Summer Conference 2025: PCB Innovation in Edinburgh
04/18/2025 | EIPCEIPC have very wisely selected this wonderful city in Scotland as the venue for their Summer Conference on June 3-4. Whilst delegates will be distilling the proven information imparted by the speakers in the day, in the evening they will be free spirits at the Conference Dinner.
Real Time with... IPC APEX EXPO 2025: IPC Mexico Building Community and Partnerships
04/17/2025 | Real Time with...IPC APEX EXPOLorena Villanueva highlights IPC Mexico's three-year journey focused on community building and partnerships with governments and educational institutions. Key milestones include collaboration agreements with state governments and universities to enhance the electronics industry. IPC Days promotes networking and education, while a partnership with UNAM aims to integrate IPC training into engineering programs. The discussion wraps up with congratulations on IPC Mexico's achievements and the launch of the Mexico pavilion at this year's show.
IPC APEX EXPO 2025 Learning Lounge: Education on the Show Floor
04/16/2025 | Andy Shaughnessy, Design007The conference portion of IPC APEX EXPO has been providing educational opportunities for attendees since the first show. But recently, show managers decided to expand education onto the show floor.
Saab Receives Order for Additional Live Training Equipment from U.S. Marine Corps
04/15/2025 | SaabSaab has received a contract modification award from the U.S. Marine Corps for additional Marine Corps Training Instrumentation Systems (MCTIS) equipment.
MVTec HALCON Version Includes Deep Learning-Based Technology for Robust Bin Picking
04/15/2025 | MVTecMVTec Software GmbH, a leading global manufacturer of machine vision software, is launching the new version of MVTec HALCON on May 27, 2025. Version 25.05 of the standard machine vision software includes numerous improvements as well as a new technology that combines deep learning algorithms with classic methods.