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KYZEN to Feature KYZEN E5631J and AQUANOX A4618 at SMTA Michigan Expo and Tech Forum
August 15, 2024 | KYZEN'Estimated reading time: Less than a minute
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Michigan Expo and Tech Forum, scheduled to take place Tuesday, August 27, 2024 at Laurel Manor in Livonia, Michigan. During the event, the KYZEN Clean Team will highlight understencil cleaner KYZEN E5631J and inline cleaning solution AQUANOX A4618.
KYZEN provides cleaning solutions for every phase of PCB production with easy-to-use and effective cleaning solutions like KYZEN E5631J and AQUANOX A4618.
KYZEN E5631J is a ready-to-use alternative to IPA for removing all types of raw solder paste from stencils in online and offline stencil cleaning processes to ensure every print counts. The proven compatibility of E5631J covers an array of common stencils, cleaning equipment and printer manufacturers.
AQUANOX A4618 is a low VOC aqueous cleaning chemistry designed to address the challenges of cleaning the latest lead-free flux residues including no-clean and Pb-free residues. A4618 is effective at lower concentrations and temperatures in addition to proving safe for multi-pass applications.
For more than 30 years, KYZEN has met unique cleaning challenges in a variety of PCB production processes by developing and providing innovative and effective chemistries like KYZEN E5631J and AQUANOX A4618.
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12/16/2024 | GlobeNewswireThe PCB Cleaning Machines Market is driven by the need for efficient removal of harmful residues from printed circuit boards, ensuring reliability and performance of electronic devices.
IPC Webinar: Optimizing Cleaning Products Used in Electronics Manufacturing
12/02/2024 | IPCThe electronics industry is committed to improving manufacturing practices and one way to do this is using safer and more sustainable cleaning products across the electronics manufacturing life cycle.
ZESTRON South Asia releases whitepaper – Impact of Cleaning Technology on Discrete Packaging - The Difference in Wire Bonding Yield
12/02/2024 | ZESTRONZESTRON, the global leading provider of high precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is pleased to release the whitepaper “Impact of Cleaning Technology on Discrete Packaging - The Difference in Wire Bonding Yield”
The Knowledge Base: The Impact of Harsh Environments on Residue Tolerance
11/26/2024 | Mike Konrad -- Column: The Knowledge BaseElectronic devices are ubiquitous, performing critical functions in a wide range of applications, from consumer electronics to aerospace, medical devices, automotive systems, and industrial control systems. Many of these devices operate in harsh environments characterized by extremes in temperature, humidity, pollution, and chemical exposure.