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Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
August 16, 2024 | Nolan Johnson, I-Connect007Estimated reading time: 3 minutes

Here in the Pacific Northwest, late summer is often referred to as its own distinct season: “Road Construction Season.” The weather is predictably conducive to this kind of work, where it seems that projects spring up on every street corner. My local city water department is tearing up the street in front of my home, and I try to remember that the inconvenience is temporary. When they’re done, the water system in the neighborhood will be better. However, I'm moving to a new city this week, and this inconvenience of the water department actually means I can't get my moving truck as close to my apartment as I'd like. It's going to be a tricky weekend.
Interestingly, that same theme shows up in this week’s must-reads. People are on the move, new books are being released, and a new PCB manufacturer is making waves. This week, I'm highlighting the latest ASC/Sunstone book on DFM essentials, our 40th book in the I-Connect007 library and a must-read whether you're a new or seasoned member of industry. I'm also including leadership news from NextFlex, a journey with Alpha Circuit and IPS, a discussion on integrated passives from Joe Fjelstad, and a new processor chip from Intel meant specifically for automotive applications.
Have a great weekend, and I hope your road construction season is more tolerable than mine.
From Concept to Reality: Building Alpha Circuit
Published August 14
This is a 2-for-1: Barry Matties recently visited with Prashant Patel of Alpha Circuit to learn more about its new, built-from-the-ground-up 45,000-square-foot factory in Schaumburg, Illinois. On that journey with him was Mike Brask of IPS, highlighted in the recent article, Thriving Through Partnership: Alpha Circuit's Journey With IPS. What I love about this is you get to see the perspective from both sides: the manufacturer and the supplier. We don't see too many greenfield PCB sites these days, so when it happens, it's definitely worth reading about.
NextFlex Names Dr. Gamota as Incoming Executive Director
Published August 15
NextFlex announced the appointment of Dr. Daniel Gamota, a well-known and experienced manufacturing and technology executive, to lead NextFlex into its next chapter as Executive Director, effective September 1, 2024. Dr. Gamota succeeds Dr. Malcolm Thompson, the inaugural executive director of NextFlex. NextFlex leads a consortium of companies, academic institutions, non-profits, state and local governments, and federal government agencies that collaborate to advance the technology, manufacturing, and commercialization of hybrid electronics. Learn more about NextFlex and Gamota here.
Design More Efficiently: Read the Latest Book From I-Connect007
Published August 14
IPC instructor Kris Moyer offers a recommendation on this latest book, DFM Essentials, from Anaya Vardya of ASC/Sunstone. He writes, “Whether you are new to PCB design or a seasoned designer, this book is an excellent resource. It covers many important concepts and informational topics to help ensure you achieve a successful, high-quality, high-yield PCB design the first time and every time.” I couldn't agree more. This book is a guide to designing manufacturability and cost efficiency into your circuit boards.
Flexible Thinking: Integrated Passive Devices—Design Solutions With Many Benefits
Published August 13
Joe Fjelstad considers integrated passive devices and their role in the modern age. IPDs have been a well-known concept for quite some time, as Joe points out. But has their time finally come for wider adoption? Especially in evolving automotive applications? Read on to find out.
Intel Brings Discrete GPU Muscle to the Vehicle Cockpit to Power Next-Gen Automotive AI
Published August 12
Speaking of automotive applications, Intel “unveiled its first discrete graphics processing unit (dGPU), the Intel Arc Graphics for Automotive.” Intel stated the new dGPU will be commercially deployed in vehicles as soon as 2025, “accelerating automobile technology and unlocking a new era of AI-driven cockpit experiences and enhanced personalization for manufacturers and drivers alike.”
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FocalPoint Announces Strategic Collaboration with STMicroelectronics to Deliver an Enhanced GNSS Solution for Automotive
05/20/2025 | PRNewswireFocalPoint, a UK-based software company providing next-gen positioning solutions for automotive, wearables and smartphones, has announced a strategic collaboration with STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications.
Flexible PCB Market to Reach $61.75B by 2032, Driven by the Demand for Compact Electronics, Automotive and Medical Applications
05/16/2025 | Globe NewswireAccording to the SNS Insider, “The Flexible PCB Market was valued at USD 21.42 billion in 2023 and is expected to reach $61.75 billion by 2032, growing at a CAGR of 12.52% over the forecast period 2024-2032.”
Driving to the Future: A Pivotal Role in Standards for IPC China Automotive Electronics Committee
05/20/2025 | Sydney Xiao, IPCIn 2024, China’s automotive industry reached new heights. According to the China Association of Automobile Manufacturers (CAAM), the annual production of passenger vehicles surpassed 31 million units, marking a 4% year-over-year growth. Meanwhile, the production of new energy vehicles exceeded 12 million units, a remarkable 36.4% increase. Behind these impressive numbers lies a collective effort fueled by technological innovation, industrial upgrades, and the dedication of countless industry professionals.
Top 10 OSAT Companies of 2024 Revealed—China Players See Double-Digit Growth, Reshaping the Global Market Landscape
05/13/2025 | TrendForceTrendForce’s latest report on the semiconductor packaging and testing (OSAT) sector reveals that the global OSAT industry in 2024 faced dual challenges from accelerating technological advancements and ongoing industry consolidation.
Cadence, AVCC to Advance Physical AI Innovations for Autonomous Vehicles
05/12/2025 | Cadence Design SystemsCadence has joined the Autonomous Vehicle Computing Consortium (AVCC), marking a significant step forward in Cadence's commitment to advancing autonomous vehicle technology for the physical AI era by working with industry leaders to define high-performance computing (HPC) and safety solutions for next-generation autonomous vehicle systems.