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CoWoS Drives Demand for Advanced Packaging Equipment; Sales Expected to Surpass 10% Growth in 2024
August 29, 2024 | TrendForceEstimated reading time: 1 minute
TrendForce reveals that sales of advanced packaging equipment are expected to grow by more than 10% in 2024, with the potential to exceed 20% in 2025. This growth is being driven by major semiconductor manufacturers’ ongoing expansion of advanced packaging capacity and the rapidly expanding global AI server market.
The growing need for AI servers is propelling the advancement of several cutting-edge packaging technologies—including InFO, CoWoS, and SoIC—ushering in a new era for the semiconductor industry. Around the world, new facilities for innovative packaging are being created. For example, TSMC is increasing its capacity for advanced packaging in Zhunan, Taichung, Chiayi, and Tainan, among other areas in Taiwan. In a similar vein, Intel is also establishing operations in New Mexico, USA, as well as Kulim and Penang in Malaysia. Meanwhile, major memory suppliers like Samsung, SK hynix, and Micron are launching new HBM packaging facilities in the US, South Korea, Taiwan, and Singapore.
Advanced packaging equipment includes tools such as electroplating machines, die bonders, molting machines, thinning machines, ball placement machines, dicing machines, curing overs, and marking machines. The supply chain for advanced packaging equipment has lower entry barriers unlike front-end process equipment, which is dominated by major US, Japanese, and European companies due to its high technical barriers and significant R&D investment. Leading foundries like TSMC are strategically nurturing local suppliers to reduce costs and establish a trustworthy local supply chain, making advanced packaging a key growth driver for Taiwanese manufacturers of packaging equipment.
Furthermore, Taiwan’s global reputation in the early development and manufacturing of machine tools has given its equipment suppliers a strong foundation in advanced packaging technologies. The continuous cultivation of talent in the field of mechanical processing also positions Taiwanese companies favorably to enter the market for advanced packaging equipment.
For Taiwanese manufacturers, the ability to expand production capacity in line with the growth of the advanced packaging equipment market will be crucial to their operational growth. Taiwanese packaging equipment companies will have opportunities to expand into foreign markets in addition to working with top foundries and OSATs as major semiconductor manufacturers continue to increase their capacity for advanced packaging.
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09/16/2024 | IPCThe increasing complexity of integrated systems demands a holistic approach to design, materials, assembly, reliability, and metrology across all levels of integration, from chip to package to board. IPC’s Technology Solutions group addresses these challenges and suggests a comprehensive roadmap in their new white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges.”
From Silicon to Systems
09/10/2024 | Andy Shaughnessy, Design007 MagazineFor the past few years, IPC has been championing the term “silicon to systems.” More than a buzzword, it has become a slogan—and even a kind of roadmap—for the organization. The term comes in especially handy when IPC is advocating for this industry in Washington, D.C., often addressing politicians who have little understanding of electronics technology.
Nordson Electronics Solutions to Exhibit at SEMICON Taiwan 2024
08/28/2024 | Nordson Electronics SolutionsNordson Electronics Solutions, a global leader in electronics manufacturing technologies, will feature the latest technologies in fluid dispensing for semiconductor advanced packaging at the SEMICON Taiwan tradeshow, booth L0516.
Why You Need to Take This New ‘Semiconductor Essentials’ Course
08/26/2024 | I-Connect007 Editorial TeamRecently, Andy Shaughnessy and Nolan Johnson met with Soo Lan Cheah, the developer of a new IPC course geared toward PCB manufacturing professionals who have little to no knowledge about semiconductor manufacturing. With her background in PCB and IC design, Soo Lan brings a circumspect vision of these disciplines and how they are inter-related. You don’t need to know a lot of math to take this course, and you’ll come out with a much better understanding of the whole silicon-to-systems approach.
Pre-registration Now Open for NEPCON ASIA 2024: Experience the Future of Electronics Manufacturing
08/23/2024 | PRNewswireNEPCON ASIA 2024, one of the most influential events in electronics manufacturing, organized by RX Shenzhen, will take place from November 6-8, 2024, at the Shenzhen World Exhibition & Convention Center (Bao'an).