Elementary, Mr. Watson: Design Intent Over Design Speed
Beyond Design: Managing Linear Workflow Bottlenecks
Connect the Dots: The Future of Designing for Reality—Outer Layer Imaging
Surface Finish: Tune in to the Latest Podcast Episode of On the Line with… ASC Sunstone
September 4, 2024 | I-Connect007Estimated reading time: Less than a minute
Don't miss episode 11 of "On the Line with… ASC Sunstone: Designing for Reality," in which ASC Sunstone’s General Manager, Matt Stevenson, discusses the critical topic of surface finishes in PCB manufacturing.
Continuing our deep dive into the PCB manufacturing process, Matt discusses the various types of surface finishes, including Hot Air Solder Leveling (HASL), Immersion Silver, ENIG (Electroless Nickel Immersion Gold), ENIPIG (Electroless Nickel Immersion Palladium Immersion Gold), and Immersion Tin. Each finish is broken down in terms of its benefits, drawbacks, and ideal applications, offering listeners valuable insights into choosing the right finish for their specific needs.
I-Connect007 is dedicated to delivering high-quality digital content specifically designed for the electronics industry. With a portfolio that includes magazines, books, newsletters, market reports, podcasts, and event coverage, the company consistently provides the insights and information professionals need. As the industry's longest-running digital media company, I-Connect007 continues to set the standard as a leading publisher of original content for the global electronics community.
Visit our educational resource center to access more free content and stay ahead in the ever-evolving electronics industry.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Uyemura Opens Dedicated UBM and Prototype Plating Line at Southington Tech Center
11/25/2025 | UyemuraUyemura has commissioned a dedicated plating tool at its Southington, CT Tech Center that addresses 3 urgent needs.
DuPont/Qnity Innovators in Semiconductor Materials Named 2025 Heroes of Chemistry
06/10/2025 | DuPontDuPont today announced that 13 of its current and former scientists and engineers have been named 2025 Heroes of Chemistry by the American Chemical Society (ACS) for an innovative program that progressed semiconductor lithography.
Indium to Showcase Innovative Materials Powering AI Technology at Productronica China
03/25/2025 | Indium CorporationAs a proven leader in Metal-Based Thermal Interface materials solutions for future-forward technologies, Indium Corporation will proudly showcase its portfolio of thermal interface materials (TIMs) that enabling AI advancements at Productronica China, March 26-28, in Shanghai, China.
Connect the Dots: Designing for Reality—Surface Finish
01/29/2025 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we discussed the solder mask and legend process, one of the final steps in the PCB manufacturing process. The board is nearly complete. We just need to wrap up production by applying a surface finish to protect the copper from oxidation and facilitate soldering components onto the board.
Exploring Advanced PCB Final Finishing: DIG, RAIG Technologies
10/24/2024 | Rich DePoto, UyemuraIn this interview, Rich DePoto of Uyemura provides a deep overview and explanation of Reduction-assisted Immersion Gold (RAIG) and direct immersion gold (DIG) technology, and their applications and benefits when compared to traditional final finishes. He delves into the intricacies of electroless nickel corrosion and “black pad,” exploring its causes, consequences, and the measures that can be taken to mitigate this problem. This comprehensive overview will provide insight toward sound decision-making for those operating in environments where perfect process control is a challenge.