Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Omni Design Technologies Partners with Aura Intelligent Systems on Next Generation Radar

09/16/2024 | BUSINESS WIRE
Omni Design Technologies, a leading provider of high-performance, low-power data acquisition and signal-processing solutions, and Aura Intelligent Systems, a developer of high-resolution imaging radar for ADAS and autonomous vehicles, announced a partnership on Aura’s next generation digital radar development.

Aspocomp to Showcase Expertise at European Microwave Exhibition

09/16/2024 | Aspocomp
Aspocomp, a leading provider of advanced printed circuit board (PCB) solutions, is excited to announce its participation at the European Microwave Exhibition (EuMW) 2024.

Circuit Technology Center Announces Expanded Tinning Services Capacity

09/16/2024 | Circuit Technology Center
Circuit Technology Center announces it has expanded its electronic component tinning services capacity.  Four (4) Hentec-Odyssey 1325 robotic hot solder dip machines are in full operation to meet the increasing demand from the defense and high-reliability customer base that requires component tinning services for tin whisker mitigation, gold mitigation, and lead re-conditioning.

Technology Roadmaps: September 2024 Issue of PCB007 Magazine

09/16/2024 | I-Connect007 Editorial Team
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to these all-important questions: What is my company’s technology roadmap? Is there anything so epic that it will change my business and/or my industry significantly in the near and distant future? What is driving the changes I will make in my facility? And most importantly, how will I implement this vision and reach the intended destination for my organization?

Comtech Launches New Digital Common Ground Modem Product Line for DoD and Coalition Customers

09/13/2024 | BUSINESS WIRE
Comtech, a global technology leader, today announced the launch of the Company’s new Digital Common Ground (“DCG”) portfolio of modems.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in