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Occam Strengthens Leadership Team with Addition of PCB Expert Dana Korf

11/14/2024 | The Occam Group
The Occam Group, developers of an innovative advanced electronics manufacturing methodology announced the addition of Dana Korf (Korf Consultancy) to its leadership team. Korf, a seasoned PCB professional, will play a pivotal role in driving innovation and expanding Occam’s capabilities for the electronics industry.

Enabling Technology will Transform Hi-rel Electronics

11/07/2022 | The Occam Group
A Game-changing component assembly methodology will transform product confidence in the harshest environments.

Flexible Thinking: The Many Benefits of Eliminating (Most) Solder

07/04/2022 | Joe Fjelstad -- Column: Flexible Thinking
Many scientists are familiar with the concept of Occam’s Razor (also sometimes called the Law of Parsimony). The basic idea postulates that when attempting to explain any given observed phenomena, the simplest explanation is preferable to those which are more complex. The reasoning behind the concept is that simple theories are easier to examine and verify, and not coincidently, are more often found to be true. Simplicity is a theme that has been recommended time and again by some of the greatest minds in history.

Flexible Thinking: Process Flow for Occam QFN Test Vehicle

05/19/2021 | Joe Fjelstad -- Column: Flexible Thinking
Joe Fjelstad teaches the Occam process through a series of steps and images. These solutions can significantly reduce the number of process steps required to manufacture an electronic module or assembly (perhaps by as much as one-third) and in the process making electronic assemblies more reliable and less costly by fundamentally focusing on the elimination of solder and the soldering process.

Joe Fjelstad Breaks Down His Occam Process

03/04/2020 | I-Connect007 Editorial Team
Joe Fjelstad recently met with the I-Connect007 Editorial Team to discuss the potential benefits of his Occam process for solderless assembly. This technique allows assembly of the PCB without the risks associated with traditional surface-mount processes, such as solder joint failure. Has the time come for the industry to embrace Occam?
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