Happy’s Tech Talk #34: Producibility and Other Pseudo-metrics
It’s Only Common Sense: Results Come from Action, Not Intention
The New Chapter: Navigating Maternity Leave in the Electronics Industry
Occam Strengthens Leadership Team with Addition of PCB Expert Dana Korf
November 14, 2024 | The Occam GroupEstimated reading time: 1 minute
The Occam Group, developers of an innovative advanced electronics manufacturing methodology announced the addition of Dana Korf (Korf Consultancy) to its leadership team. Korf, a seasoned PCB professional, will play a pivotal role in driving innovation and expanding Occam’s capabilities for the electronics industry.
“We are thrilled to welcome Dana to the Occam team,” said Ray Rasmussen, Managing Partner. “His years in the PCB industry and deep expertise in PCB design and manufacturing will be invaluable as we continue to advance and improve the capabilities of the Occam Process.”
Korf has worked on a wide range of complex PCB projects. His knowledge and skills will be instrumental in optimizing the Occam Process for component assemblies. By eliminating the traditional soldering process, Occam offers numerous advantages, including improved reliability, reduced costs, and enhanced environmental sustainability. In addition, Occam’s inherent capabilities include: improved thermal management, EMI mitigation and reduced RF interference, simplifying designs and manufacturing. Occam’s additive approach lends itself to significantly greater efficiencies and is positioned to lead the industry for years to come.
Occam inventor, Joe Fjelstad stated, “The continuing industry journey to create PCBs to meet future product needs for advanced electronics has resulted in a significant increase in complexity and cost, severely limiting the number of prospective manufacturers to meet those needs. The investment required to fabricate advanced PCB based packaging solutions are approaching those required for making semiconductor ICs thus fiscally limiting growth and constraining the supply base. The Occam concept seeks to significantly simplify the manufacturing process, allowing more to be done with less, greatly reducing the need for these very complex designs currently driving the industry. One area where we know Dana will be able to make significant contributions is in defining and realizing the additive/3D printing opportunity for Occam. It is an area where he has competently demonstrated his industry recognized vision and leadership”
“I am excited to join Occam and contribute to the advancement of this innovative methodology,” said Korf. “Occam has the potential to transform the electronics industry, and I look forward to working with the Occam team to make this happen.”
Share on:
Suggested Items
Eagle Circuits Joins Effort to Transform U.S. Electronics Manufacturing
09/03/2024 | Eagle CircuitsAs part of an effort to demonstrate Occam’s superiority over conventional assemblies, Eagle Circuits of Dallas, Texas, has been selected to build the first set of Occam test assemblies.
Enabling Technology will Transform Hi-rel Electronics
11/07/2022 | The Occam GroupA Game-changing component assembly methodology will transform product confidence in the harshest environments.
Flexible Thinking: The Many Benefits of Eliminating (Most) Solder
07/04/2022 | Joe Fjelstad -- Column: Flexible ThinkingMany scientists are familiar with the concept of Occam’s Razor (also sometimes called the Law of Parsimony). The basic idea postulates that when attempting to explain any given observed phenomena, the simplest explanation is preferable to those which are more complex. The reasoning behind the concept is that simple theories are easier to examine and verify, and not coincidently, are more often found to be true. Simplicity is a theme that has been recommended time and again by some of the greatest minds in history.
Flexible Thinking: Process Flow for Occam QFN Test Vehicle
05/19/2021 | Joe Fjelstad -- Column: Flexible ThinkingJoe Fjelstad teaches the Occam process through a series of steps and images. These solutions can significantly reduce the number of process steps required to manufacture an electronic module or assembly (perhaps by as much as one-third) and in the process making electronic assemblies more reliable and less costly by fundamentally focusing on the elimination of solder and the soldering process.
Joe Fjelstad Breaks Down His Occam Process
03/04/2020 | I-Connect007 Editorial TeamJoe Fjelstad recently met with the I-Connect007 Editorial Team to discuss the potential benefits of his Occam process for solderless assembly. This technique allows assembly of the PCB without the risks associated with traditional surface-mount processes, such as solder joint failure. Has the time come for the industry to embrace Occam?