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This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
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Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
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I-Connect007 Editor's Choice: Five Must-Reads for the Week
September 6, 2024 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes
I’ve been reading up on artificial intelligence news for a while now, and there’s a shift in the conversation, toward a more data- and results-driven view of AI and the claims of change it will bring. We’re starting to see research on why AI models behave the way they do (sometimes with behavior that is catastrophic to the AI itself), and what causes them to go astray. I’m collecting this research for an upcoming talk at a conference, and possibly a future article on the topic. Without spoiling my talk, let me just say that we don’t have much to fear about AI taking over the world yet. In the meantime, there are many things that you can control right now. To wit:
This week’s Top 5 starts with steps you can take to cultivate a culture of thriving. We also have bullish news from the global semiconductor sector, advice on how to tease out hidden cost drivers during the PCB design cycle, how the Altium-Ansys collaboration will affect design, and Happy Holden’s version of Occam’s Razor—three simple tools to keep your wet processes in line.
I can also share from personal experience that asking ChatGPT to make a margarita for happy hour will leave you unfulfilled; ask a trained human professional to do that for you instead. Have a great weekend!
Why a Culture of Thriving Matters
Published August 30
In the August issue of SMT007 Magazine, Audrey McGuckin, principal at The McGuckin Group, identifies a problem she encounters regularly in her consulting work: Burnout and disruption. Audrey shares her findings on how to counter burnout and disruptions in this article. Read all about it!
Global Semiconductor Sales Increase 18.7% Year-to-Year in July
Published September 3
Quoting the press release, “The global semiconductor market continued to grow substantially on a year-to-year basis in July, and month-to-month sales increased for the fourth consecutive month,” said John Neuffer, SIA president and CEO. “The Americas market experienced particularly strong growth in July, with a year-to-year sales increase of 40.1%.” Is this a trailing indicator of reshoring or nearshoring? This news item includes sales numbers for other regions also; I’ll leave the answer to that question as an exercise for the reader.
Hidden Cost Drivers in PCB Design
Published September 5
Cherie Litson points out that “everything you’ve read about the cost-saving process is controlled by the project leader’s actions. This article, originally appearing in Design007 Magazine’s August 2024 issue, dives into the project manager’s role as a cost influencer, and why so many design problems originate in that office.
Impact of the Altium-Ansys Partnership on PCB Design
Published September 5
The importance—and effect—of signal and power integrity just keeps growing. Altium’s Josh Moore postulates that while it is necessary to have good simulation tools to help with SI and PI, it is not sufficient. Read here how Josh envisions the Altium/Ansys collaboration will help shift the design cycle.
Happy’s Tech Talk #32: Three Simple Ways to Manage and Control Wet Processes
Published September 3
Optimizing wet process is like flying a helicopter: they can easily fly out of control if you’re not paying attention. In this edition of Happy’s Tech Talk, Happy considers the simple tools which can help you keep an eye on your wet process operating tolerances.
Suggested Items
Are Our Stackup Rules No Longer Valid?
12/19/2024 | Cherie Litson, EPTAC MIT CID/CID+Are the stackup rules we used to follow no longer valid? It depends on what you’re designing. Electrical rules change depending on your circuit. Fabrication rules change depending on which fabricator you’re working with. Today, we just have more options, and sometimes, cost is a bigger rule than anything else. If you search online for information about layer stackups, trace widths, and hole sizes in PCBs, you’ll find a variety of resources.
Statistically Testing Inner Layer Yield Improvement Projects
12/18/2024 | Dr. Patrick Valentine, UyemuraCan we trust our measurement system to give us reliable data? Is it accurate, repeatable, and reproducible? Measurement is the foundation of quality. We measure for two primary reasons: to make decisions on product quality and to provide data that will inform continuous improvement projects. We can engage in continuous improvement projects if we are confident in our measurement systems.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
IPC Releases Latest List of Standards and Revisions
12/17/2024 | IPC Community Editorial TeamEach quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q4 2024.
Global PCB Connections: Following DFM Rules Leads to Better Boards
12/18/2024 | Jerome Larez -- Column: Global PCB ConnectionsAs a PCB field applications engineer, ensuring smooth communication between PCB designers and fabricators is one of my frequent challenges. A critical part of that dialogue is design for manufacturing (DFM). Many designers, even experienced ones, often misunderstand or overlook important DFM considerations. They may confuse design rules with manufacturing minimums, leading to technically feasible designs that are difficult or costly to produce. In this column, I will clarify some common DFM guidelines and help designers understand the difference between “design rules” and “minimums” while sharing best practices that will simplify the production process and ensure the highest quality PCB.