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This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
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Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
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PCB Workshop and Plant Tour Hosted by the SMTA Wisconsin Chapter
September 9, 2024 | SMTAEstimated reading time: Less than a minute
The SMTA Wisconsin Chapter invites you to attend a PCB workshop and plant tour on September 11, 2024.
Event Details:
- Date: September 11, 2024
- Location: La Sure's Hall Banquets & Catering, Oshkosh, WI
- Topic: PCB Fabrication Basics: Process and Specification
- Instructor: Jim Vanden Hogen, Plexus
About the Workshop:
This half-day course will provide participants with a comprehensive understanding of the multi-layer PCB fabrication process. The workshop will explore how PCB design influences fabrication steps and how the finished product integrates into the assembly process.
After the workshop and lunch, attendees will have the opportunity to tour the nearby MultiCircuits facility.
Limited Spots Available:
Only five spots remain for this exclusive event. Register now to secure your place! Visit SMTA's website for more information.
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Effects of Advanced Packaging and Stackup Design
12/26/2024 | I-Connect007 Editorial TeamKris Moyer teaches several PCB design classes for IPC and Sacramento State, including advanced PCB design. His advanced design classes take on some really interesting topics, including the impact of a designer’s choice of advanced packaging upon the design of the layer stackup. Kris shares his thoughts on the relationship between packaging and stackup, what PCB designers need to know, and why he believes, “The rules we used to live by are no longer valid.”