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AIM to Present on Ultra-Miniature Component Assembly at SMT-Info

10/02/2024 | AIM
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMT-Info Technical Conference taking place October 15-16 in Brno, Czech Republic.

Mycronic’s Jet Set Technology

10/02/2024 | Nolan Johnson, SMT007 Magazine
In this interview, Wolfgang Heinecke, head of global product management at Mycronic, discusses advancements and applications of jet printing technology, which offers solutions to the challenges faced by traditional stencil printing. He highlights the key benefits of jet printing, and explains the qualification process for solder paste compatibility as well as the software-driven nature of jet printing, which allows for quick program creation and real-time adjustments.

SMTA Carolinas Chapter Hosts Expert-Led Webinar: “Mastering Solder Paste Printing for Optimal SMT Assembly”

09/24/2024 | Koh Young
The SMTA Carolinas Chapter invites you to attend an informative webinar on "Mastering Solder Paste Printing for Optimal SMT Assembly" on Tuesday, October 15, 2024, from 12:00 PM to 1:00 PM (Eastern).

Understanding Cleaning Challenges for Automated Solder Paste Dispensing

09/18/2024 | Debbie Carboni, KYZEN
In today’s rapidly evolving electronics manufacturing landscape, staying abreast of innovative technologies is crucial. As solder paste and substrate materials continually evolve and become more complex, optimizing production methods with the latest technology ensures performance and quality while reducing operational costs.

The Knowledge Base: The Pivotal Role of Solder Paste

09/16/2024 | Mike Konrad -- Column: The Knowledge Base
In the complex world of electronics manufacturing, the humble solder paste plays a pivotal role. Often overshadowed by more conspicuous electronics assembly equipment and materials, this blend of powdered metal and flux is the unsung hero that binds the electronic circuits together. But beyond its adhesive and conductive properties, the selection of the right solder paste is crucial for ensuring the long-term reliability of electronic devices.
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