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Understanding Cleaning Challenges for Automated Solder Paste Dispensing

09/18/2024 | Debbie Carboni, KYZEN
In today’s rapidly evolving electronics manufacturing landscape, staying abreast of innovative technologies is crucial. As solder paste and substrate materials continually evolve and become more complex, optimizing production methods with the latest technology ensures performance and quality while reducing operational costs.

Successful Rehm Technology Days 2024 – Where the Future Meets Technology

09/17/2024 | Rehm Thermal Systems
Traditionally, the Rehm Technology Days offer a valuable opportunity for knowledge exchange, networking and discussion. Once again this year, numerous customers, partner companies, press representatives and employees from the worldwide locations met at the company headquarters in Blaubeuren-Seissen.

Circuit Technology Center Announces Expanded Tinning Services Capacity

09/16/2024 | Circuit Technology Center
Circuit Technology Center announces it has expanded its electronic component tinning services capacity.  Four (4) Hentec-Odyssey 1325 robotic hot solder dip machines are in full operation to meet the increasing demand from the defense and high-reliability customer base that requires component tinning services for tin whisker mitigation, gold mitigation, and lead re-conditioning.

The Knowledge Base: The Pivotal Role of Solder Paste

09/16/2024 | Mike Konrad -- Column: The Knowledge Base
In the complex world of electronics manufacturing, the humble solder paste plays a pivotal role. Often overshadowed by more conspicuous electronics assembly equipment and materials, this blend of powdered metal and flux is the unsung hero that binds the electronic circuits together. But beyond its adhesive and conductive properties, the selection of the right solder paste is crucial for ensuring the long-term reliability of electronic devices.

Making Waves With Solder Paste Jetting

09/11/2024 | Josh Casper, Horizon Sales
As electronics shrink and PCB density grows, traditional solder deposition methods such as stencil printing face significant challenges. One solution making substantial waves is solder paste jetting. Solder paste jetting is no secret. In fact, the development and commercialization of this technology has been around since the early 2000s. So, why now? We’ve arrived at a time in which the maturity of this technology has intersected with new demands of electronics manufacturing.
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