Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."

Klaus Koziol - atg

Suggested Items

STMicroelectronics Expands Silicon Photonics Production for AI Demand

03/09/2026 | STMicroelectronics
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, is now entering high-volume production for its state-of-the-art silicon photonics-based PIC100 platform used by hyperscalers for optical interconnect for data centers and AI clusters.

Baya Systems and Aion Silicon Partner to Accelerate Next-Generation SoC and Chiplet Designs

02/24/2026 | BUSINESS WIRE
Baya Systems, a pioneer in software-driven, chiplet-ready semiconductor fabric IP for scalable AI, high-performance computing (HPC), and automotive applications, announced a partnership with Aion Silicon (formerly Sondrel), a leading ASIC and SoC architecture and design services company.

ChipAgents Raises $74M to Scale an Agentic AI Platform to Accelerate Chip Design

02/18/2026 | BUSINESS WIRE
ChipAgents, the category leader for Agentic AI platforms in the semiconductor design industry, announced it has closed an oversubscribed $50 million Series A1 funding round, bringing total capital raised to $74 million.

UHDI Fundamentals—Foundations and Drivers of the PCB Flex: Advanced Packaging Nexus, Part 1

03/02/2026 | Anaya Vardya, American Standard Circuits
The electronics industry is undergoing a fundamental transformation driven by demands for smaller form factors, higher performance, and greater functional integration. Two technologies sit at the center of this transformation: flexible PCBs and advanced semiconductor packaging. In this article, I’ll explore the technical foundations and key forces driving this convergence. Flexible PCBs are electrical interconnects fabricated on bendable substrates such as polyimide or polyester. Unlike rigid PCBs, flex circuits can conform to three-dimensional shapes, enabling designers to route signals through space rather than across flat planes.

Designers Notebook: Heterogeneous Interposer Design Challenge, Part 2

02/16/2026 | Vern Solberg -- Column: Designer's Notebook
As the need grows for higher processing speed and the expanded functionality required for newer generations of central processing units (CPUs), the necessity for higher-density interconnect solutions is paramount. The current trend toward furnishing a single, monolithic system-level semiconductor package has become a serious yield issue in fabrication. For example, with all of the peripheral supporting functions on a single die platform, wafer fabrication yields are often below target and, although the CPU portion of a monolithic semiconductor may be perfect, if one or more of the supporting functions on the same die fails, the entire processor unit must be discarded. 
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in