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North American Wi-Fi Sensing CPE Installations to Surge to 112 Million by 2030

11/15/2024 | ABI Research
Wi-Fi Sensing uses Wi-Fi RF wave attenuation to detect presence and motion, offering a cost-effective, easily deployable solution. Major Wi-Fi chipset vendors supporting infrastructure markets are backing this technology.

ISAC Has Groundbreaking Potential to Transform 6G Networks After 2033

11/11/2024 | ABI Research
Integrated Sensing and Communication (ISAC) is a groundbreaking concept aiming to turn mobile networks into radars that can sense moving objects in their vicinity. According to a new report from global technology intelligence firm ABI Research, ISAC is a revolutionary innovation poised to transform the future of 6G networks.

Hitachi, UTokyo Promote Joint Research for the Practical Application of High-resolution Laser-PEEM in the Semiconductor Field

11/07/2024 | JCN Newswire
Hitachi High-Tech Corporation and The University of Tokyo have been conducting joint research into practical applications of high-resolution Laser-PEEM(1) developed by UTokyo in the semiconductor manufacturing process.

Despite Regional 200x Funding Differences, Post-Quantum Readiness Won’t Hinder eIDAS Unity

11/05/2024 | ABI Research
Post-Quantum Cryptography (PQC) inevitably has an outsized impact on a technology remit covering many trust service use cases, with cryptographically robust signing acting as the market's core. Without this, there is no trust and, therefore, no Electronic Identification and Trust Services (eIDAS).

SIA Commends Selections for CHIPS R&D Flagship Facilities

11/04/2024 | SIA
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the selections for the first two CHIPS for America National Semiconductor Technology Center (NSTC) facilities.
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