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I-Connect007 Releases New Episode of Meet the Author Podcast: Spotlight on Complex PCB Design
December 10, 2024 | I-Connect007Estimated reading time: Less than a minute
I-Connect007 is thrilled to announce the latest installment of its Meet the Author podcast series, hosted by Nolan Johnson. In episode 2 of the series, Johnson interviews Scott Miller and Brian White of Freedom CAD, who share their expertise on complex PCB design.
The discussion revolves around Miller’s book, The Printed Circuit Designer's Guide to... Executing Complex PCBs. The authors delve into the seven key disciplines essential for designing sophisticated printed circuit boards, offering listeners actionable insights and strategies. In addition, Miller and White provide updated perspectives that reflect the dynamic nature of today’s electronics industry.
Whether you're an industry veteran or just starting your PCB design journey, this episode is packed with valuable advice to elevate your design methodology.
Available Now: Stream the episode, here, and explore the audio version of the book, here.
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Sweeney Ng - CEE PCBSuggested Items
I-Connect007 Releases Episode 5 of Groundbreaking Ultra HDI Podcast Series
10/10/2025 | I-Connect007In Episode 5 “Via Structures,” host Nolan Johnson welcomes back John Johnson, Director of Quality and Advanced Technology at American Standard Circuits. Together, they explore the designer’s perspective on UHDI’s impact on via structures, diving into the metallurgy, chemistry, mechanical considerations, and stackup reduction that provide greater design flexibility and fewer constraints than ever before.
New Podcast Episode: How Does UHDI Benefit SWaP?
10/03/2025 | I-Connect007In podcast episode 4, “SWaP Considerations,” host Nolan Johnson welcomes back industry expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC). Together, they explore how UHDI delivers measurable advantages in size, weight, and power (SWaP)—unlocking new possibilities in speed, efficiency, and miniaturization.
New Podcast Episode Drop: Optimize the Interconnect—It’s a Wrap!
09/29/2025 | I-Connect007The final episode of the On the Line with… Optimize the Interconnect podcast series ties together insights from across the program, underscoring the growing importance of unified solutions for high-volume HDI PCB manufacturing. Final guest Kuldip Johal, Chief Technology Officer and Vice President of Business Development, emphasized that manufacturers must balance yield, reliability, and scalability as interconnect density and complexity continue to increase.
Meet the Author Podcast Features Dr. Pritha Choudhury
09/24/2025 | I-Connect007I-Connect007 announces the latest episode of its Meet the Author podcast series, spotlighting Dr. Pritha Choudhury, a co-author of The Printed Circuit Assembler’s Guide to Low-temperature Soldering, Volume 2. In this conversation with SMT007 Managing Editor Nolan Johnson, Dr. Choudhury explains why a second volume was essential and explores the real-world factors accelerating the adoption of low-temperature soldering across the electronics manufacturing industry.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/16/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest On the Line With... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).