Global Citizenship: Comparing and Contrasting the U.S. and China PCB Industries
Standard of Excellence: Finding and Hiring the Right Candidates for Engineering Positions
Global Sourcing Spotlight: 10 Rules of the Game
Global Semiconductor Packaging Material Market Outlook Shows Return to Growth Starting in 2024
October 2, 2024 | SEMIEstimated reading time: 1 minute
Powered by strong semiconductor demand across diverse end applications, the global semiconductor packaging materials market is expected to start a growth cycle with a 5.6% compound annual growth rate (CAGR) projected through 2028, SEMI, TECHCET and TechSearch International announced in their latest Global Semiconductor Packaging Materials Outlook (GSPMO) report. The report highlights AI as an expected growth driver for advanced packaging applications, despite currently low unit volumes due to the newness of the market segment.
The GSPMO report provides comprehensive data and forecasts for substrates, leadframes, bonding wire, and additional advanced packaging materials.
“After a challenging 2023, which saw a 15.5% decline in the semiconductor packaging materials market, our latest report forecasts a return to growth in 2024,” said Lita Shon-Roy, TECHCET President and CEO. “The global packaging materials market is expected to exceed $26 billion by 2025 and continue solid growth through 2028.”
Global packaging materials
“Substrates account for a large portion of the revenue for the packaging materials market, and within the category, FC-BGA substrates make up the majority of the revenue growth,” said Jan Vardaman, President of TechSearch International. “The CAGR for flip chip BGA/LGA revenue is expected to be 7.6% from 2023 to 2028. Other key growth areas include wafer-level packaging (WLP) dielectrics and flip chip underfill. The laminate substrates segment is expected to grow 7.3% annually in volume, while leadframes and bonding wire are also forecasted to recover, growing by 5.0% and 6.4%, respectively.”
The GSPMO 2024 report is designed to help companies capitalize on emerging trends, navigate supply chain challenges, and make informed decisions in sourcing high-performance materials.
Share on:
Suggested Items
Coastal RF Systems Joins StratEdge’s Network as Manufacturer’s Representative for Southern California
10/31/2024 | StratEdgeStratEdge Corporation, a leader in high-performance semiconductor packaging solutions, has appointed Coastal RF Systems as its exclusive Manufacturer's Representative for Southern California.
SEMICON Japan 2024 to Expand Scope with Spotlight on Advanced Design Innovation
10/23/2024 | SEMISEMICON Japan 2024, the largest gathering of leaders from the microelectronics manufacturing supply chain in Japan, will assemble more than 1,000 exhibitors showcasing semiconductor solutions for smart technologies from Dec. 11-13 at Tokyo Big Sight.
Unlock Unmatched Performance for Matched Impedance Devices with StratEdge at IEEE BCICTS 2024
10/22/2024 | StratEdgeStratEdge Corporation, an industry leader in high-frequency and high-power semiconductor packaging, is excited to announce its participation in the IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS).
Calumet Electronics Leads US Organic Substrate Technology Innovation with KLA Corporation
10/17/2024 | Calumet ElectronicsCalumet Electronics of Michigan today announced it is pioneering organic substrate technology in the United States in collaboration with KLA Corporation, which also has a Michigan headquarters. KLA Corporation is a global technology leader that develops equipment and services to enable innovation throughout the electronics industry. The company provides advanced process control and process-enabling solutions used in the manufacturing of semiconductors and electronics.
SEMICON Europa 2024 to Explore Innovations in Advanced Packaging and Fab Management for a Sustainable Future
10/15/2024 | SEMISemiconductor industry experts will convene at SEMICON Europa 2024, November 12-15 at Messe München in Munich, to explore the latest trends and innovations in advanced packaging and fab management.