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IPC Releases Latest List of Standards and Revisions

12/17/2024 | IPC Community Editorial Team
Each quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q4 2024.

Global PCB Connections: Following DFM Rules Leads to Better Boards

12/18/2024 | Jerome Larez -- Column: Global PCB Connections
As a PCB field applications engineer, ensuring smooth communication between PCB designers and fabricators is one of my frequent challenges. A critical part of that dialogue is design for manufacturing (DFM). Many designers, even experienced ones, often misunderstand or overlook important DFM considerations. They may confuse design rules with manufacturing minimums, leading to technically feasible designs that are difficult or costly to produce. In this column, I will clarify some common DFM guidelines and help designers understand the difference between “design rules” and “minimums” while sharing best practices that will simplify the production process and ensure the highest quality PCB.

Foxconn Honored with Seven TAISE Sustainability Awards

12/17/2024 | Hon Hai Technology Group
Hon Hai Technology Group (Foxconn), a global technology leader, has been recognized with seven prestigious awards from the Taiwan Sustainable Energy Research Foundation (TAISE) Sustainability Series. This recognition underscores the company’s commitment to environmental sustainability and social responsibility.

Taiwanese PCB Industry Witnessed Steady Growth of 9.6% in Q3 2024

12/12/2024 | TPCA
The global output value of Taiwanese circuit board enterprises demonstrated steady growth in the third quarter of 2024, reaching NT$227.1 billion, a year-over-year increase of 9.6%.

Happy’s Tech Talk #35: Yields March to Design Rules

12/12/2024 | Happy Holden -- Column: Happy’s Tech Talk
Ultra high density interconnect (UHDI) has many forms, structures, and alternatives, so capturing all the variations and reducing them to design rules has required some departures from traditional IPC design standards. In this column, I’ll be discussing the IPC UHDI design guidelines and standards. The fundamental question is: “Do you need HDI or microvias?”
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