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Ventec Presents Cutting Edge Innovations and High-performance Formulas at IPC APEX EXPO 2025

03/14/2025 | Ventec International Group
Ventec International Group is presenting new substrate materials and proven formulas for high-performance PCBs at IPC APEX Expo 2025, alongside the latest advances in manufacturing equipment from Ventec Giga Solutions.

Ventec International Group Announce Launch of VT-47LT IPC4101 /126 Prepreg for HDI

03/12/2025 | Ventec International Group
Ventec International Group announce launch of VT-47LT IPC4101 / 126 Prepreg. Are Microvia Failures Plaguing Your HDI Any Layer Designs? High-density interconnect (HDI) designs are pushing the envelope - higher layer count HDI relies on complex microvia designs: skip vias, staggered microvias, and stacked microvias in sequential laminations.

Chris Mundy Joins Ventec as Commercial Director for EMEA & Americas

03/07/2025 | Ventec
Ventec International Group is delighted to announce the appointment of Chris Mundy as Commercial Director for EMEA & Americas.

Sunny Kwok Joins Ventec as Technical Sales Representative for UK and EMEA

02/14/2025 | Ventec
Ventec is pleased to announce the appointment of Sunny Kwok as Technical Sales Representative for UK and EMEA regions. Sunny will further enhance service support levels for Ventec full range of materials including non-reinforced resin coated copper and film products (thermal/Pro-bond), high speed/low loss (tec-speed) and Ventec’s full range of halogen free materials for high reliability applications.

Ventec Confirms Thailand as Location for New State-of-the-Art PCB Material Manufacturing Facility

12/17/2024 | Ventec International Group
Ventec International Group Co., Ltd. announces that Thailand has been selected as the location for its new state-of-the-art PCB materials manufacturing facility.
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