Beyond Design: AI-driven Inverse Stackup Optimization
Global PCB Connections: Following DFM Rules Leads to Better Boards
Elementary Mr. Watson: How to Reinvent Your Professional Journey
PCB007 Magazine October 2024: Alternate Metallization Processes
October 16, 2024 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop. In the October 2024 issue of PCB007 Magazine, we examine alternate metallization methods, including MacDermid Alpha’s graphite technology and Uyemura’s RAIG technology.
In addition, John Johnson of American Standard Circuits discusses liquid metal ink as a process technology alternative. Dyconex talks about alternative metal elements from the standpoint of R&D and explains sputtering technology. And we revisit Mike Carano’s comprehensive overview of direct metallization technology from our July 2024 issue of PCB007 Magazine.
For all of that and more, get onboard for destination metallization.
Share on:
Suggested Items
Green Tech Accelerator: Tackling Water Resource Challenges and Unlocking Renewable Energy Opportunities
12/26/2024 | BUSINESS WIREGreen Tech Accelerator collaborates with startups, offering courses, mentorship, and international market strategies to implement and validate carbon reduction solutions. This Taiwanese initiative empowers SMEs to progress toward net-zero emissions.
Compal Adopts Intel Tech for Innovative Liquid Cooling Solutions
12/26/2024 | Compal Electronics Inc.Compal Electronics, a leading server solution provider, announced today its collaboration with Intel, BP Castrol (Castrol), JWS, and Priver to launch a groundbreaking liquid cooling solution based on Intel’s Targeted Flow technology. Designed specifically for high-density servers and AI data centers, this innovative solution aims to drive the industry toward a more efficient and sustainable future.
Biden-Harris Administration Announces CHIPS Incentives Award with Amkor Technology to Bring End-to-End Chip Production to the U.S.
12/25/2024 | U.S. Department of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce awarded Amkor Technology Arizona, Inc., a subsidiary of Amkor Technology, Inc., up to $407 million in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
SMT Mounter Market Size Projected to Reach $5.06 Billion by 2030
12/23/2024 | openPRAccording to the new market research report "Global SMT (Surface-mount Technology) Mounter Market Report 2024-2030", published by QYResearch, the global SMT (Surface-mount Technology) Mounter market size is projected to reach USD 5.06 billion by 2030, at a CAGR of 4.7% during the forecast period.
Apple’s Vision Pro Reshapes the VR/MR Landscape, Driving Applications from Entertainment to Productivity Tools
12/23/2024 | TrendForceTrendForce’s latest report estimates that global shipments of VR and MR headsets are expected to reach approximately 9.6 million units in 2024, representing a YoY increase of 8.8%.