-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssuePartial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
Silicon to Systems: From Soup to Nuts
This month, we asked our expert contributors to weigh in on silicon to systems—what it means to PCB designers and design engineers, EDA companies, and the rest of the PCB supply chain... from soup to nuts.
Cost Drivers
In this month’s issue of Design007 Magazine, our expert contributors explain the impact of cost drivers on PCB designs and the need to consider a design budget. They discuss the myriad design cycle cost adders—hidden and not so hidden—and ways to add value.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
PCB007 Magazine October 2024: Alternate Metallization Processes
October 16, 2024 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop. In the October 2024 issue of PCB007 Magazine, we examine alternate metallization methods, including MacDermid Alpha’s graphite technology and Uyemura’s RAIG technology.
In addition, John Johnson of American Standard Circuits discusses liquid metal ink as a process technology alternative. Dyconex talks about alternative metal elements from the standpoint of R&D and explains sputtering technology. And we revisit Mike Carano’s comprehensive overview of direct metallization technology from our July 2024 issue of PCB007 Magazine.
For all of that and more, get onboard for destination metallization.
Suggested Items
BOOK EXCERPT: The Printed Circuit Designer’s Guide to... DFM Essentials, Introduction
10/16/2024 | I-Connect007 Editorial TeamDesign for Manufacturing (DFM) is defined as the practice of designing printed circuit boards that meet not only the capabilities of the customer’s assembly manufacturing process, but also the capabilities of the board fabrication process to provide the highest reliability at the lowest possible cost.
Airbus, Toshiba to Partner on Superconductivity Research
10/16/2024 | AirbusAirbus UpNext, a wholly-owned subsidiary of Airbus, and Toshiba Energy Systems & Solutions Corporation (Toshiba), Toshiba Group’s energy arm, will cooperate and mutualise experience on superconducting technologies for future hydrogen-powered aircraft.
SEMICON Europa 2024 to Explore Innovations in Advanced Packaging and Fab Management for a Sustainable Future
10/15/2024 | SEMISemiconductor industry experts will convene at SEMICON Europa 2024, November 12-15 at Messe München in Munich, to explore the latest trends and innovations in advanced packaging and fab management.
Koh Young Technology Showcasing its Inspection Solutions at electronica and SEMICON Europa
10/15/2024 | Koh Young TechnologyKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, will demonstrate its award-winning inspection solutions at Messe München on November 12-15, 2024.
Ventec Promotes Bill Wang to Group Technical Vice President
10/14/2024 | VentecVentec International Group, a Taiwan Stock Exchange listed global supplier of advanced base materials for the PCB industry worldwide, has promoted Bill Wang to Group Technical Vice President.