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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Welcome to the debut issue of I-Connect007 Magazine. This publication brings all of the pieces together from PCB design and fabrication for a closer alignment and a more integrated electronics manufacturing landscape.
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FIT Hon Teng Showcases AI Data Center Connectivity and Immersion-Cooled Signal Integrity Solutions at OCP Global Summit 2024
October 21, 2024 | FoxconnEstimated reading time: 1 minute
FIT Hon Teng, a subsidiary of Hon Hai Precision Industry, will unveil its latest advancements in AI data center connectivity and immersion-cooling technologies at the upcoming 2024 OCP Global Summit. Hosted by the Open Compute Project (OCP), this prestigious event brings together global leaders in hardware infrastructure design, addressing the evolving demands of modern data centers.
At the summit, FIT will introduce solutions that tackle critical challenges in AI-driven data centers, including signal degradation, heat dissipation, and large-scale manufacturing scalability. FIT’s AI rack connectivity innovations are designed to enhance signal integrity and optimize data transmission, all while incorporating advanced cooling technologies for high-density AI workloads.
Key product highlights include:
- 224G+ sockets for XPU/GPU connectivity
- Co-packaged copper and optical architectures
- Power cables for ORV3
- Active Optical Cables (AOC)
- OSFP1600 and QSFP-DD port configurations
These solutions underscore FIT’s commitment to driving innovation in the AI data center space, building on Foxconn’s extensive industrial internet expertise to offer cutting-edge AI connectivity solutions to global data center customers.
In addition to its AI connectivity offerings, FIT will present its immersion-cooled IT platform solutions at the summit. Terry Little, Development Engineering Manager at FIT, will lead a session titled “Optimizing Signal Integrity in Immersion-Cooled IT Platforms.” The session will delve into the effects of dielectric fluids on high-speed signal lines, the challenges of high-speed testing in such environments, and innovative connector fixture strategies. These solutions are critical for ensuring reliable performance in harsh, high-density computing environments, such as AI data centers.
By addressing key issues such as performance, efficiency, and scalability, FIT continues to play a pivotal role in supporting the growth of AI infrastructure across industries, further solidifying its leadership in AI data center solutions.
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Brent Fischthal - Koh YoungSuggested Items
IPC CFX Demo Line Debuts in Korea at EMK 2026
04/10/2026 | Global Electronics AssociationAt Electronics Manufacturing Korea (EMK) x NEPCON Korea 2026, the Global Electronics Association, in collaboration with 13 companies, showcased the IPC CFX Demo Line (Connected Factory Exchange demonstration line), marking its debut in Korea.
Honeywell’s Mission-Critical Technologies Help Enable NASA's Crewed Artemis II Mission
04/08/2026 | HoneywellBuilding on the success of the Artemis I mission, Honeywell has provided multiple critical technologies for NASA's Artemis II launch and ongoing mission around the moon.
Critical Manufacturing Named in 2026 Gartner® Market Guide for MES
04/07/2026 | Critical ManufacturingCritical Manufacturing, the Industrial Operations Platform company that unites execution, connectivity, analytics and trusted AI, and a subsidiary of ASMPT, has been named a Representative Vendor in the Gartner Market Guide for Manufacturing Execution Systems (MES).
ICT Spend in Asia/Pacific to Reach $647 Billion in 2026
04/06/2026 | IDCAccording to the latest update of the International Data Corporation’s (IDC) Worldwide ICT Spending Guide Enterprise and SMB by Industry, ICT spending across Asia/Pacific excluding Japan and China (APEJC) is forecast to reach $647 billion in 2026 and is projected to surpass $758 billion by 2029.
SMT Perspectives & Prospects: Artificial Intelligence, Part 7—Data Module 2
04/08/2026 | Dr. Jennie Hwang -- Column: SMT Perspectives and ProspectsWhen I last wrote about data, I focused on data quality and size, data infrastructure, the boundaries of data training, data preparation, and the general challenges and concerns of data. This month, I will focus on alternative approaches, data governance, retrieval-augmented generation (RAG), and agentic RAG.