Fresh PCB Concepts: Key Considerations for Reliability, Performance, and Compliance in PCBs
Elementary Mr. Watson: Navigating RF—A Glide Path Approach to Design Success
Designers Notebook: Layer Stackup Planning for RF Circuit Boards
FIT Hon Teng Showcases AI Data Center Connectivity and Immersion-Cooled Signal Integrity Solutions at OCP Global Summit 2024
October 21, 2024 | FoxconnEstimated reading time: 1 minute
FIT Hon Teng, a subsidiary of Hon Hai Precision Industry, will unveil its latest advancements in AI data center connectivity and immersion-cooling technologies at the upcoming 2024 OCP Global Summit. Hosted by the Open Compute Project (OCP), this prestigious event brings together global leaders in hardware infrastructure design, addressing the evolving demands of modern data centers.
At the summit, FIT will introduce solutions that tackle critical challenges in AI-driven data centers, including signal degradation, heat dissipation, and large-scale manufacturing scalability. FIT’s AI rack connectivity innovations are designed to enhance signal integrity and optimize data transmission, all while incorporating advanced cooling technologies for high-density AI workloads.
Key product highlights include:
- 224G+ sockets for XPU/GPU connectivity
- Co-packaged copper and optical architectures
- Power cables for ORV3
- Active Optical Cables (AOC)
- OSFP1600 and QSFP-DD port configurations
These solutions underscore FIT’s commitment to driving innovation in the AI data center space, building on Foxconn’s extensive industrial internet expertise to offer cutting-edge AI connectivity solutions to global data center customers.
In addition to its AI connectivity offerings, FIT will present its immersion-cooled IT platform solutions at the summit. Terry Little, Development Engineering Manager at FIT, will lead a session titled “Optimizing Signal Integrity in Immersion-Cooled IT Platforms.” The session will delve into the effects of dielectric fluids on high-speed signal lines, the challenges of high-speed testing in such environments, and innovative connector fixture strategies. These solutions are critical for ensuring reliable performance in harsh, high-density computing environments, such as AI data centers.
By addressing key issues such as performance, efficiency, and scalability, FIT continues to play a pivotal role in supporting the growth of AI infrastructure across industries, further solidifying its leadership in AI data center solutions.
Share on:
Suggested Items
Navigating Global Manufacturing in an Era of Uncertainty
05/07/2025 | Philip Stoten, ScoopThe EMS industry faces unprecedented challenges as global trade tensions rise and tariff announcements create market uncertainty. In an overview of IPC Europe’s podcast, MADE IN EUROPE, industry experts from GPV and Zollner examine how these developments impact our businesses and customers, and what strategies will prevail in this new landscape.
From Execution to Intelligence: A Data-driven Approach to Modern Manufacturing
05/06/2025 | Barry Matties, I-Connect007In this discussion, Augusto Vilarinho, an MES expert at Critical Manufacturing, explores the essential functions of MES in tracking and tracing shop floor activities where AI and machine learning capabilities are purposely built into the MES through it's embedded data platform, capturing all machine data, integrating and connecting with different systems, ERPs, physical equipment, and people.
AT&S Starts High Volume Manufacturing at New Plant in Kulim/Malaysia
05/06/2025 | AT&SAT&S Austria Technologie & Systemtechnik (Malaysia) Sdn Bhd is ready to start high volume manufacturing at the new campus at Kulim Hi-Tech Park (KHTP) in the state of Kedah. AT&S Malaysia delivers high-end Integrated Circuit (IC) Substrates for AMD’s data center processors and other customers.
New Database of Materials Accelerates Electronics Innovation
05/05/2025 | ACN NewswireIn a collaboration between Murata Manufacturing Co., Ltd., and the National Institute for Materials Science (NIMS), researchers have built a comprehensive new database of dielectric material properties curated from thousands of scientific papers.
New Database of Materials Accelerates Electronics Innovation
05/02/2025 | ACN NewswireIn a collaboration between Murata Manufacturing Co., Ltd., and the National Institute for Materials Science (NIMS), researchers have built a comprehensive new database of dielectric material properties curated from thousands of scientific papers.