Beyond Design: Micro-ohm Power Delivery Network for AI-driven GPUs
Fresh PCB Concepts: Quick-turn Prototype PCB Fabrication to Production Volume
Elementary, Mr. Watson: The Four Horsemen of Copper Confusion
FIT Hon Teng Showcases AI Data Center Connectivity and Immersion-Cooled Signal Integrity Solutions at OCP Global Summit 2024
October 21, 2024 | FoxconnEstimated reading time: 1 minute
FIT Hon Teng, a subsidiary of Hon Hai Precision Industry, will unveil its latest advancements in AI data center connectivity and immersion-cooling technologies at the upcoming 2024 OCP Global Summit. Hosted by the Open Compute Project (OCP), this prestigious event brings together global leaders in hardware infrastructure design, addressing the evolving demands of modern data centers.
At the summit, FIT will introduce solutions that tackle critical challenges in AI-driven data centers, including signal degradation, heat dissipation, and large-scale manufacturing scalability. FIT’s AI rack connectivity innovations are designed to enhance signal integrity and optimize data transmission, all while incorporating advanced cooling technologies for high-density AI workloads.
Key product highlights include:
- 224G+ sockets for XPU/GPU connectivity
- Co-packaged copper and optical architectures
- Power cables for ORV3
- Active Optical Cables (AOC)
- OSFP1600 and QSFP-DD port configurations
These solutions underscore FIT’s commitment to driving innovation in the AI data center space, building on Foxconn’s extensive industrial internet expertise to offer cutting-edge AI connectivity solutions to global data center customers.
In addition to its AI connectivity offerings, FIT will present its immersion-cooled IT platform solutions at the summit. Terry Little, Development Engineering Manager at FIT, will lead a session titled “Optimizing Signal Integrity in Immersion-Cooled IT Platforms.” The session will delve into the effects of dielectric fluids on high-speed signal lines, the challenges of high-speed testing in such environments, and innovative connector fixture strategies. These solutions are critical for ensuring reliable performance in harsh, high-density computing environments, such as AI data centers.
By addressing key issues such as performance, efficiency, and scalability, FIT continues to play a pivotal role in supporting the growth of AI infrastructure across industries, further solidifying its leadership in AI data center solutions.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
OpenAI and Foxconn Collaborate toStrengthen U.S. Manufacturing Across the AI Supply Chain
11/21/2025 | OpenAIOpenAI announces a collaboration with Foxconn focused on design work and U.S. manufacturing readiness for the next generation of AI infrastructure hardware. As part of this work, OpenAI will share insight into emerging hardware needs across the AI industry to help inform Foxconn’s design and development efforts for hardware to be manufactured at Foxconn’s U.S. facilities.
What Emerging Circularity Policies Mean for the Electronics Industry
11/20/2025 | I-Connect007 Editorial TeamAs Europe accelerates toward a circular economy, electronics manufacturers face a wave of new sustainability requirements that will redefine product design, materials management, and end-of-life strategies. During a Nov. 11 webinar co-hosted by the Global Electronics Association and the Anthesis Group, industry leaders outlined the regulatory landscape shaping the next decade, including the Eco-design for Sustainable Products Regulation (ESPR), the Right to Repair (R2R) Directive, and the Extended Producer Responsibility (EPR) regulatory framework.
Wearable Medical Devices Market to Surge to $184.75 Billion by 2033
11/19/2025 | PRNewswireAccording to recent research, the market was valued at $42.1 billion in 2024 and is projected to reach $184.75 billion by 2033, driven by rapid consumer adoption, healthcare digitalization, and the integration of intelligent monitoring technologies.
Delta, Siemens to Complement their Power Solutions to Help Customers Cut Data Center Deployment Time, Costs, and Carbon Emissions
11/19/2025 | PRNewswireDelta, a global leader in power management and smart green solutions, and Siemens Smart Infrastructure have formalized a global partnership to deliver prefabricated, modular power solutions designed to accelerate the deployment of data center infrastructure, while significantly reducing CAPEX.
Dell Technologies Advances Enterprise AI Innovation With NVIDIA
11/18/2025 | BUSINESS WIREDell Technologies, the world’s top provider of AI infrastructure,1 and NVIDIA are delivering the future of enterprise AI with advancements to the Dell AI Factory with NVIDIA