-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueRules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
Silicon to Systems: From Soup to Nuts
This month, we asked our expert contributors to weigh in on silicon to systems—what it means to PCB designers and design engineers, EDA companies, and the rest of the PCB supply chain... from soup to nuts.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Combatting Advanced Techniques in Counterfeiting
October 30, 2024 | Anthony BryantEstimated reading time: 1 minute
In today's interconnected global marketplace, counterfeit electronics pose a significant threat to industries ranging from aerospace and defense to healthcare and telecommunications. As counterfeiters employ increasingly sophisticated techniques, the need for robust strategies to prevent, mitigate, and identify counterfeit components has become critical. This article explores the advanced techniques used in counterfeiting, the potential involvement of state-owned enterprises (SOEs), and comprehensive strategies for combating this pervasive issue.
Advanced Techniques in Counterfeiting
Counterfeiters continually evolve their methods to produce fake electronic components that closely mimic authentic parts. Some of the most advanced techniques include:
- Re-marking and re-packaging: Altering legitimate part markings and repackaging components to misrepresent them as new or different parts.
- Exploiting supply chain vulnerabilities: Counterfeiters exploit vulnerabilities in the supply chain, introducing fake components that can go undetected until integrated into critical systems.
- Reverse engineering: This process involves disassembling genuine products to replicate their design and functionality, creating clones that are difficult to distinguish from the original.
- Use of cutting-edge technologies: Counterfeiters leverage advanced technologies like artificial intelligence (AI), 5G, and quantum computing to produce highly accurate replicas that challenge conventional detection methods.
Figure 1: Four key entry points of counterfeits into the electronic components supply chain.
The Role of State-Owned Enterprises
Chinese state-owned enterprises (SOEs) have been implicated in producing cloned counterfeit electronic parts, particularly complex semiconductor chips like fine-pitch grid arrays (FPGAs) and microcontrollers. These components are essential in high-stakes applications, including medical, military, and aerospace systems.
The cloning process often involves reverse engineering authentic products and, in some cases, intellectual property theft. SOEs possess advanced manufacturing technologies that allow them to produce high-quality counterfeit components, making it challenging to distinguish between genuine and cloned parts. The involvement of SOEs is particularly concerning due to their access to advanced manufacturing technologies and potential for large-scale operations.
To read the entire article, which original published in the October 2024 SMT007 Magazine, click here.
Suggested Items
Indie Semiconductor Extends Automotive Photonics Leadership with Advanced Optical Component Integration Capabilities
11/20/2024 | indie Semiconductorindie Semiconductor, an automotive solutions innovator, has extended its photonics offering with the addition of in-house photonics integration, packaging and system test capabilities.
ASMPT: Highly Flexible Die and Flip-chip Bonder for Co-packaged Optics Production
11/20/2024 | ASMPTThe high-precision AMICRA NANO die and flip-chip bonder has been specially developed for the production of co-packaged optics where which optical and electronic components are integrated in a common housing. With its exceptional process stability and a placement accuracy of ±0.2 μm @ 3 σ, this innovative bonding system is ideally equipped for the communication technology of the future.
Nano Dimension Unveils 3D Printer for Micro Applications at Formnext
11/19/2024 | Nano DimensionNano Dimension, a leading supplier of Additively Manufactured Electronics (AME) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (AM) 3D printing solutions, announces the launch of its Exa 250vx Digital Light Processing (DLP) 3D Printer for micro applications. Developed to enable the creation of superior resolution micro parts at high production throughput, the high-speed Exa was unveiled today for the first time globally at Formnext in Frankfurt, Germany (Hall 11, Stand D22).
IPC Introduces First Standard for In-Mold Electronics
11/18/2024 | IPCIPC announces the release of IPC-8401, Guidelines for In-Mold Electronics. IPC-8401 addresses in-mold electronics (IME) technology, providing industry consensus on guidelines for manufacturing processes, part structures, material selection, and production test methods to integrate printed electronics and components into 3D smart structures.
ZenaTech Participates in Taiwan Trade Mission to Open First Asian Office for ZenaDrone AI Drone Sensor and Component Manufacturing
11/07/2024 | NEWMEDIAWIREZenaTech, Inc., a technology company specializing in AI (Artificial Intelligence) drone solutions and enterprise SaaS (Software-as-a-Service) solutions, announces that company principals are currently participating in a Trade Mission to Taipei, Taiwan as part of an Arizona Commerce Authority (ACA) delegation, with the goal of opening a manufacturing office for its previously announced Spider Vision Sensors Ltd. subsidiary.