-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueRules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
Silicon to Systems: From Soup to Nuts
This month, we asked our expert contributors to weigh in on silicon to systems—what it means to PCB designers and design engineers, EDA companies, and the rest of the PCB supply chain... from soup to nuts.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
First Annual SEMIEXPO Heartland Event to Assemble Leaders in Smart Manufacturing and Smart Mobility
November 7, 2024 | SEMIEstimated reading time: 1 minute
With automotive electronics and Industry 4.0 serving as key semiconductor industry growth drivers, SEMI Americas’ inaugural SEMIEXPO Heartland event will gather key smart manufacturing and smart mobility stakeholders from April 1-2, 2025, at the Indiana Convention Center in Indianapolis. Registration is now open.
“The Midwestern U.S. is rising as a key innovation region for both smart mobility and smart manufacturing,” said Joe Stockunas, President of SEMI Americas. “We created SEMIEXPO Heartland in collaboration with our partners, to unite mobility and manufacturing leaders and uncover new business and networking opportunities. The conference program will focus on solving industry challenges and will highlight emerging innovations, as mobility and manufacturing continue to propel the semiconductor market forward.”
The SEMIEXPO Heartland event’s Smart Mobility track will connect professionals in the mobility, semiconductor, and sensor ecosystems to address technical issues and supply chain dynamics. This track will also explore the latest innovations in MEMS, power semiconductors, chiplets, and systems, during the following sessions:
- Electric Vehicles and Power Semiconductors Driving Sustainability
- Chiplets Reshaping the Compute Architecture
- Autonomous Vehicles Powered by AI Technology
- MEMS and Sensors, the Indispensable Source for Smart Vehicles
The Smart Manufacturing track will provide insights into Industry 4.0 methods where artificial intelligence (AI) and machine learning (ML) are improving quality, yield, and reliability at a reduced overall manufacturing cost. As wafer fabs accelerate deployment of technologies like digital twins, data analytics, and AI, companies focused on assembly, packaging, and test (APT) are working to overcome challenges associated with this next phase of digital development. Smart Manufacturing track sessions include:
- Chips and the Future of U.S. Semiconductor APT – Keynote
- APT Innovations Unleashed
- Smart Manufacturing for APT: Data Analytics/AI and Digital Twins
- Robotics and Automation for APT
- Future OSAT and APT Factories
SEMIEXPO Heartland will also feature a Workforce Development Pavilion to create career awareness for students, military veterans, and other job seekers, including those from adjacent manufacturing industries. The pavilion will host resume review sessions, flash mentoring, “day in the life” sessions led by industry professionals, and SEMI University educational classes.
Suggested Items
PCB Design Software Market Expected to Hit $9.2B by 2031
11/21/2024 | openPRThis report provides an overview of the PCB design software market, detailing key market drivers, challenges, technological advancements, regional dynamics, and future trends. With a projected compound annual growth rate (CAGR) of 13.4% from 2024 to 2031, the market is expected to grow from USD 3.9 billion in 2024 to USD 9.2 billion by 2031.
SIA Applauds CHIPS Award for Semiconductor Research Corporation’s SMART USA Institute
11/21/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the announcement that the U.S. Department of Commerce and the Semiconductor Research Corporation Manufacturing Consortium Corporation (SRC) are entering negotiations for the Commerce Department to provide SRC $285 million to establish and operate the CHIPS Manufacturing USA Institute for Digital Twins.
SIA Praises Finalization of CHIPS Investments for GlobalFoundries Manufacturing Projects
11/21/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding finalization of semiconductor manufacturing investments announced by the U.S. Department of Commerce and GlobalFoundries.
IPC Issues Clarion Call for EU to Reclaim Leadership in Electronics Manufacturing
11/21/2024 | IPCIPC released a synopsis of its recent white paper, Securing the European Union’s Electronics Ecosystem. This condensed document presents a comprehensive overview of the current challenges in Europe’s electronics manufacturing industry and shares actionable steps to help the EU achieve a stronger, more autonomous ecosystem.
CHIPS for America Announces Up to $300M in Funding to Boost U.S. Semiconductor Packaging
11/21/2024 | U.S. Chamber of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry.