Elementary, Mr. Watson A Designer's Dilemma—Metric or Imperial Units?
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
Flexible Thinking: Musings on High Density Interconnections
First Annual SEMIEXPO Heartland Event to Assemble Leaders in Smart Manufacturing and Smart Mobility
November 7, 2024 | SEMIEstimated reading time: 1 minute
With automotive electronics and Industry 4.0 serving as key semiconductor industry growth drivers, SEMI Americas’ inaugural SEMIEXPO Heartland event will gather key smart manufacturing and smart mobility stakeholders from April 1-2, 2025, at the Indiana Convention Center in Indianapolis. Registration is now open.
“The Midwestern U.S. is rising as a key innovation region for both smart mobility and smart manufacturing,” said Joe Stockunas, President of SEMI Americas. “We created SEMIEXPO Heartland in collaboration with our partners, to unite mobility and manufacturing leaders and uncover new business and networking opportunities. The conference program will focus on solving industry challenges and will highlight emerging innovations, as mobility and manufacturing continue to propel the semiconductor market forward.”
The SEMIEXPO Heartland event’s Smart Mobility track will connect professionals in the mobility, semiconductor, and sensor ecosystems to address technical issues and supply chain dynamics. This track will also explore the latest innovations in MEMS, power semiconductors, chiplets, and systems, during the following sessions:
- Electric Vehicles and Power Semiconductors Driving Sustainability
- Chiplets Reshaping the Compute Architecture
- Autonomous Vehicles Powered by AI Technology
- MEMS and Sensors, the Indispensable Source for Smart Vehicles
The Smart Manufacturing track will provide insights into Industry 4.0 methods where artificial intelligence (AI) and machine learning (ML) are improving quality, yield, and reliability at a reduced overall manufacturing cost. As wafer fabs accelerate deployment of technologies like digital twins, data analytics, and AI, companies focused on assembly, packaging, and test (APT) are working to overcome challenges associated with this next phase of digital development. Smart Manufacturing track sessions include:
- Chips and the Future of U.S. Semiconductor APT – Keynote
- APT Innovations Unleashed
- Smart Manufacturing for APT: Data Analytics/AI and Digital Twins
- Robotics and Automation for APT
- Future OSAT and APT Factories
SEMIEXPO Heartland will also feature a Workforce Development Pavilion to create career awareness for students, military veterans, and other job seekers, including those from adjacent manufacturing industries. The pavilion will host resume review sessions, flash mentoring, “day in the life” sessions led by industry professionals, and SEMI University educational classes.
Share on:
Suggested Items
Nortech Systems Reports Net Sales of $31.4 Million in Q3 2024
11/08/2024 | Nortech SystemsNortech Systems Incorporated, a leading provider of engineering and manufacturing solutions for complex electromedical and electromechanical products serving the medical, industrial and defense markets, reported financial results for the third quarter ended September 30, 2024.
Hitachi, UTokyo Promote Joint Research for the Practical Application of High-resolution Laser-PEEM in the Semiconductor Field
11/07/2024 | JCN NewswireHitachi High-Tech Corporation and The University of Tokyo have been conducting joint research into practical applications of high-resolution Laser-PEEM(1) developed by UTokyo in the semiconductor manufacturing process.
ZenaTech Participates in Taiwan Trade Mission to Open First Asian Office for ZenaDrone AI Drone Sensor and Component Manufacturing
11/07/2024 | NEWMEDIAWIREZenaTech, Inc., a technology company specializing in AI (Artificial Intelligence) drone solutions and enterprise SaaS (Software-as-a-Service) solutions, announces that company principals are currently participating in a Trade Mission to Taipei, Taiwan as part of an Arizona Commerce Authority (ACA) delegation, with the goal of opening a manufacturing office for its previously announced Spider Vision Sensors Ltd. subsidiary.
Flex Wins Cisco 2024 Excellence in ESG Award
11/06/2024 | FlexFlex announced it received Cisco's 2024 Excellence in ESG (Environmental, Social, and Governance) award. Cisco presented this esteemed honor at its annual Supplier Appreciation Event (SAE) to a live audience of several hundred executives representing its diverse component suppliers and partners in manufacturing, logistics, services, and repair operations.
Bell Announces Site Selection for Future Long Range Assault Aircraft Fuselage Assembly
11/06/2024 | Bell Textron Inc.Bell Textron Inc., a Textron Inc. company, announced the site selection for the Future Long Range Assault Aircraft (FLRAA) fuselage assembly in Wichita, Kansas at an existing facility located at Beech Field on Textron Aviation’s East Campus near the site of Textron Aviation Defense. Bell plans to begin operations at the facility in the next several months.