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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Zuken USA Announces Tech Tour 2025 to Highlight the Latest Innovations in Wire Harness and Control Panel Design
February 18, 2025 | ZukenEstimated reading time: 1 minute
Zuken USA is pleased to announce the launch of Tech Tour 2025, a free, one-day event series designed to bring innovation and expertise directly to customers and industry professionals across the United States. The Tech Tour builds upon the legacy of Zuken Innovation World (ZIW), delivering a unique attendee experience tailored for engineers and engineering managers seeking to optimize E3.series-based processes and explore the application of digital engineering solutions.
The Zuken Tech Tour will feature stops in key cities across the U.S., offering attendees access to expert-led sessions, networking, and personalized learning opportunities. With a design process-focused agenda, this event is structured to inspire new ideas, streamline workflows, and foster meaningful industry connections.
Zuken is also pleased to welcome Komax as a sponsor for Tech Tour 2025. Their expertise in wire processing solutions will provide attendees with additional insights into automation and efficiency in harness manufacturing.
Event Highlights
Zuken’s Tech Tour will deliver an exceptional experience for all attendees. Expert-led sessions provide actionable tips and best practices from Zuken’s specialists in harness design and digital engineering. The onsite Expert Bar offers one-on-one guidance from product experts, allowing participants to address specific challenges and gain personalized insights. Additionally, dedicated networking opportunities enable attendees to connect with Zuken’s account teams, product specialists, and peers across the industry.
Locations and Dates:
- San Jose, CA – April 24, 2025 (San Jose Marriott)
- Dearborn, MI – June 5, 2025 (The Henry, Autograph Collection)
- Denver, CO – June 11, 2015, (The View House)
- Pittsburgh, PA – August 20, 2025 (The Westin Pittsburgh)
- Los Angeles, CA – August 27, 2025 (Sonesta Redondo Beach & Marina)
- Chicago, IL – September 10, 2025 (Chicago Marriott Suite O’Hare)
Registration is now open, and attendance is complimentary. Event details, including schedules and resources, are available on the official Tech Tour website.
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Julia McCaffrey - NCAB GroupSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
A Necessary Shift From Gerber to IPC-2581
05/07/2026 | Tracy Riggan, Global Electronics AssociationIPC-2581 is an open, vendor-neutral data exchange standard developed by the Global Electronics Association to streamline the exchange of PCB design information across fabrication, assembly, and test. It replaces multiple legacy formats—including industry standards, Gerber, and ODB++—with a single, comprehensive, XML-based dataset that captures all manufacturing details.
ViaSat-3 F3 Satellite Successfully Launches from Kennedy Space Center
05/04/2026 | BoeingBoeing mission controllers confirmed that the ViaSat-3 F3 (VS-3 F3) satellite is healthy in orbit following its successful launch aboard a SpaceX Falcon Heavy rocket at 10:13 a.m. ET from Kennedy Space Center (KSC) in Florida.
Microchip Expands Post-Quantum Root of Trust Controllers
04/29/2026 | MicrochipAs the industry embarks on the transition to post‑quantum cryptography (PQC), Microchip Technology is expanding its portfolio of Trust Shield, PQC‑ready devices with the TS1800 Platform Root of Trust controller and the TS50x secure boot controller.
Is China Plus One Still Happening in the PCB Industry?
04/28/2026 | Manfred Huschka, Manfred Huschka Management Consulting (Shenzhen) Ltd.For much of the past five years, China Plus One has been shorthand for supply-chain diversification: reducing dependency on mainland China by adding manufacturing capacity elsewhere in Asia. In the PCB industry, however, in early 2026, it is more nuanced. It looks less like a clean geographic shift and more like a layered, capital-intensive rebalancing of global capacity, one that still leaves China deeply embedded at the center.