-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueAdvanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
SIA Statement on Election Results
November 8, 2024 | SIAEstimated reading time: Less than a minute
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer regarding this week’s election results.
“We congratulate President-elect Trump, Vice President-elect Vance, and new and returning members of Congress. Policymakers from both parties recognize a strong domestic chip industry is critical to America’s economic strength, national security, technology leadership, and global competitiveness. We look forward to working with the White House and Congress to advance policies that ensure the U.S. remains the global leader in semiconductor research, design, and manufacturing to drive the technologies of the future.”
Suggested Items
Rogers Appoints Laura Russell as Chief Financial Officer
12/11/2024 | Rogers CorporationRogers Corporation announced that Laura Russell has been appointed to serve as the Company’s new Senior Vice President, Chief Financial Officer and Treasurer effective December 10.
SEMICON Japan 2024 Opens Tomorrow to Highlight Smart Applications Powered by Semiconductor Technology
12/10/2024 | SEMISEMICON Japan, the region’s premier microelectronics industry conference and exhibition, opens tomorrow at Tokyo Big Sight. With more than 1,000 exhibitors from 35 regions, the conference gathers leaders from across the microelectronics manufacturing supply chain from December 11-13. SEMICON Japan 2024.
TTM Technologies to Exhibit at the 2024 International Electronics Circuit Exhibition in Shenzhen, China
12/04/2024 | Globe NewswireTTM Technologies, Inc., a leading global manufacturer of technology solutions including mission systems, radio frequency (RF) components and RF microwave/microelectronic assemblies and printed circuit boards (PCBs), announces that it will exhibit at the 2024 International Electronics Circuit Exhibition (Shenzhen).
Indium Corporation Announces Executive Leadership Appointments
12/03/2024 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to global electronics, semiconductor, thin-film, and thermal management industries, today announced the advancement of two executives to top posts in the corporation. Former CEO Greg Evans now serves as executive chair of the board of directors. Ross Berntson has been appointed CEO and continues as president.
Intel Announces Retirement of CEO Pat Gelsinger
12/02/2024 | BUSINESS WIREIntel Corporation announced that CEO Pat Gelsinger retired from the company after a distinguished 40-plus-year career and has stepped down from the board of directors, effective Dec. 1, 2024.