-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueSignal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
Showing Some Constraint
A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
BOOK EXCERPT: The Printed Circuit Designer’s Guide to... DFM Essentials, Chapter 2
November 14, 2024 | I-Connect007 Editorial TeamEstimated reading time: 1 minute

The Printed Circuit Designer’s Guide to... DFM Essentials
by Anaya Vardya, American Standard Circuits / ASC Sunstone Circuits
Chapter 2: Panelization
Panelization is the process of placing one or more PCBs on a manufacturing panel and incorporating features to assist manufacturing (such as tooling holes, fiducials, coupons, panel thieving, etc.). Panelization is one of the highest impact factors in the cost of a PCB.
The panel area available for circuit boards plus coupons is known as the usable area (Figure 2.1). Test coupons are added by the fabricator to the perimeter of the manufacturing panel outside the usable area. The number and type of coupons are based on the specs that the PCBs are being built to and requirements for controlled impedance. Coupons may sometimes further reduce the amount of a PCB panel that is available for the circuit boards. This is defined by the fabricator as required perimeter for coupons. This is typically about 1 inch or 25.4 mm and is a fixed area based on panel size. Panel utilization is measured as a percentage, defined by the total area for PCBs divided by the total panel area.
Cost-effective material utilization is defined by a target panel with greater than 75% panel utilization. Raw laminate is one of the primary cost constituents of a multilayer PCB. Optimizing panel structures around standard base materials while achieving maximum material utilization on one of the standard panel sizes can have a significant impact on multilayer board prices and deliveries. The three most preferred sizes in North America are 12x18 inches, 18x24 inches and 21x24 inches, with 18x24 inches being the most common. For special applications, other panel sizes can be provided. In Asia, typically the shops will process custom panel sizes in order to maximize utilization. The most effective cost per unit area processed is usually found with a larger panel size.
Visit the I-Connect007 library to continue reading The Printed Circuit Designer’s Guide to DFM Essentials.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Integrating Uniplate PLBCu6 With the Digital Factory Suite
09/12/2025 | Giovanni Obino and Andreas Schatz, MKS' AtotechPrinted circuit board manufacturing is rapidly changing, driven by miniaturization, stringent reliability requirements, and growing pressure for sustainable production. Meeting these challenges requires more than incremental improvements; it demands a combination of precise equipment and real-time process intelligence. The pairing of Uniplate® PLBCu6 with the Digital Factory Suite (DFS) demonstrates how hardware and software can work together to create more responsive, resource-efficient manufacturing.
Machvision Leads Shift to Automated Inline Final Inspection, AOI in North America
09/10/2025 | Ralph Jacobo, all4-PCBSchweitzer Engineering Laboratories (SEL) chose Machvision inspection equipment due to its capabilities and versatility. Machvision of Taiwan offers circuit inspection, hole inspection and measurement, IC Substrate and HDI inspection, and final visual inspection solutions. The best fit for SEL was the 4.0Pro Circuit Inspection for inner and outer layers, and the AFI6 for final visual inspection of finished panels.
Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs
09/08/2025 | Kurt Palmer -- Column: Driving InnovationIn PCB manufacturing, the demand for increasingly complex and miniaturized designs continually pushes the boundaries of traditional fabrication methods, including depth routing. Success in these applications demands not only on robust machinery but also sophisticated control functions. PCB manufacturers rely on advanced machine features and process methodologies to meet their precise depth routing goals. Here, I’ll explore some crucial functions that empower manufacturers to master complex depth routing challenges.
Securing the Future: The Battle for America's Flat Panel Display Industry
08/12/2025 | Marcy LaRont, I-Connect007The production and sourcing of flat panel displays have become a focal point of concern, particularly regarding national security. In this interview, Jim Will, executive director of the U.S. Partnership for Assured Electronics (USPAE), provides insights into the essential role of liquid crystal displays (LCDs) in both defense systems and everyday technology. Their conversation delves into the implications of America's dependence on Chinese manufacturers for these critical components, raising alarms about supply chain vulnerabilities amidst rising geopolitical tensions.
Omdia Forecasts Large-Area Display Shipments to Grow 2.9% YoY in 2025 Despite Economic Uncertainty
07/21/2025 | BUSINESS WIREAccording to the latest analysis from Omdia’s Large-area display market tracker – 2Q25 with 1Q25 results, large-area display (above 9-inch) unit shipments are forecast to increase by 2.9% year-over-year (YoY) in 2025.