-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSoldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
The Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
IPC Hall of Fame Spotlight Series: Highlighting Patty Goldman
November 22, 2024 | Dan Feinberg, I-Connect007Estimated reading time: 1 minute
In my first article of this special series, I wrote a synopsis of the IPC Raymond E. Pritchard Hall of Fame (HOF) Award, along with a commentary on its first few members, particularly Pritchard. Over the years, IPC members who have contributed significantly to IPC and our industry have been awarded this high honor and recognition. Though many early HOF members have passed away and are unknown to today’s IPC membership, their contributions still resonate. Over the coming months, I look forward to researching and reporting on IPC Hall of Fame members and their contributions. This month, I highlight Patty Goldman.
Patty first got involved with IPC in 1981 when she volunteered to chair the Process Effects Subcommittee. She did this for many years, corralling volunteers from every facet of PCB manufacturing to work on various sections of the Troubleshooting Guide for Printed Circuit Manufacturing and Assembly through its second and third editions. At one point, due to an overload of work at IPC, she even took on the task of doing the typesetting so it could get published. Along the way, she received IPC’s President Award, became chair of the committee over the Professional Education (PE) subcommittee, and was a member of the Technical Activities Executive Committee (TAEC). She also served a two-year tenure as chair of the TAEC, considered a top volunteer position at IPC. Later, when the glass reinforcement subcommittee/task group had a stalled round-robin testing program, Patty was asked to chair the group to get it moving. One of Patty’s many significant contributions was reducing the length of the normally drawn-out TAEC meetings in half by using a focused agenda.
Patty has been a significant contributor to I-Connect007. She is the former managing editor of PCB007 Magazine and has offered her talents and expertise for many years, providing excellent show coverage through her interviews and special event write-ups at IPC APEX EXPO. You may not always agree with her viewpoint, but you can bet that you will respect, and often ask for, her opinion.
Patty received the IPC Raymond E. Pritchard Hall of Fame Award in 2015.
If you are an IPC Hall of Fame member, please help me complete this series by sending your present contact information to baer@feinline.com.
This article originally appeared in the November 2024 issue of PCB007 Magazine.
Suggested Items
IPC Announces New Training Course: PCB Design for Military & Aerospace Applications
12/23/2024 | IPCIPC announced the launch of a new training course: PCB Design for Military & Aerospace Applications.
Zhou (Peter) Guoyin: Pioneering the Standardization of ESG
12/23/2024 | Chuck Li, IPC AsiaWith more than 30 years of experience in corporate social responsibility (CSR) and environmental, social, and governance (ESG), Zhou (Peter) Guoyin has not only witnessed the evolution of CSR and ESG globally but has also been a key force in driving their development. As chair of the IPC-1401 standard committee, Zhou has led numerous innovative projects over the past 11 years and was awarded the SEDEX Supply Chain Impact Award in August 2024. In this exclusive interview, he shares valuable insights into the ESG field and the profound impact of IPC-1401 on the electronics manufacturing industry.
Are Our Stackup Rules No Longer Valid?
12/19/2024 | Cherie Litson, EPTAC MIT CID/CID+Are the stackup rules we used to follow no longer valid? It depends on what you’re designing. Electrical rules change depending on your circuit. Fabrication rules change depending on which fabricator you’re working with. Today, we just have more options, and sometimes, cost is a bigger rule than anything else. If you search online for information about layer stackups, trace widths, and hole sizes in PCBs, you’ll find a variety of resources.
IPC/WHMA Launches Groundbreaking Online Course on Wire Harness Design
12/18/2024 | IPCIPC/WHMA is excited to announce the launch of its new online instructor-led training course, "Introduction to Wire Harness Design I," available now through the IPC EDGE Learning Management System.
IPC Releases Latest List of Standards and Revisions
12/17/2024 | IPC Community Editorial TeamEach quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q4 2024.