Beyond Design: The Metamorphosis of the PCB Router
Global PCB Connections: Embedded Components—The Future of High-performance PCB Design
Elementary, Mr. Watson: PCB Routing: The Art—and Science—of Connection
ZESTRON South Asia releases whitepaper – Impact of Cleaning Technology on Discrete Packaging - The Difference in Wire Bonding Yield
December 2, 2024 | ZESTRONEstimated reading time: 1 minute
ZESTRON, the global leading provider of high precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is pleased to release the whitepaper “Impact of Cleaning Technology on Discrete Packaging - The Difference in Wire Bonding Yield”
Whitepaper Abstract:
Lead frame packages are commonly used in semiconductor package fabrication, where interconnections between the integrated circuits (IC) and the metal leads are typically established through die attach and wire bonding processes. Standard materials like epoxies, adhesives, or solder pastes are most often used in the die attach process. However, it is critical to remove any flux residues left behind after soldering before proceeding with wire bonding and molding to ensure maximum yield in packages that use solder paste for die attachment. One of the most widely used cleaning agents to remove flux residues is isopropyl alcohol (IPA). While IPA is commonly used as a general cleaner in the electronics industry, it is not the most effective solution for flux removal.
Semiconductor package manufacturers produce millions of units daily and therefore, a small improvement in the wire bonding yield can significantly impact production efficiency and the overall product costs.
One such OEM was producing lead frame packages and using IPA (Isopropyl alcohol) in the ultrasonic cleaning process. However, their process resulted in a wire bonding yield of only 98%, measured after the molding and deflashing processes. This indicated significant motivation to improve the cleaning process and the wire bonding yield.
A Design of Experiment (DOE) was developed to assess alternative cleaning agents and process equipment, aiming to optimize the cleaning process and to be evaluated based on the improvement in wire bonding yield. Process qualification was conducted through a pull test according to the MIL-STD-883E method 2011.7. Throughout the DOE process iterations, process improvements were identified through visual inspection, pull and shear testing as well as overall yield measurement from the wire bonding process.
Share on:
Suggested Items
ASC Sunstone Circuits and Screaming Circuits Partner to Launch Online Assembly Parts Ordering – A New Step Toward Seamless PCB Production
06/23/2025 | ASC SunstoneIn a major step toward simplifying the PCB manufacturing and assembly process, ASC Sunstone Circuits and Screaming Circuits are proud to announce the launch of a new online assembly parts ordering feature, now available through Sunstone.com. This enhanced capability allows customers to source assembly components as part of their PCB order, creating a fully integrated experience from bare board fabrication to finished assembly.
The Evolution of Picosecond Laser Drilling
06/19/2025 | Marcy LaRont, PCB007 MagazineIs it hard to imagine a single laser pulse reduced not only from nanoseconds to picoseconds in its pulse duration, but even to femtoseconds? Well, buckle up because it seems we are there. In this interview, Dr. Stefan Rung, technical director of laser machines at Schmoll Maschinen GmbH, traces the technology trajectory of the laser drill from the CO2 laser to cutting-edge picosecond and hybrid laser drilling systems, highlighting the benefits and limitations of each method, and demonstrating how laser innovations are shaping the future of PCB fabrication.
Day 2: More Cutting-edge Insights at the EIPC Summer Conference
06/18/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) summer conference took place this year in Edinburgh, Scotland, June 3-4. This is the third of three articles on the conference. The other two cover Day 1’s sessions and the opening keynote speech. Below is a recap of the second day’s sessions.
Beyond Design: The Metamorphosis of the PCB Router
06/18/2025 | Barry Olney -- Column: Beyond DesignThe traditional PCB design process is often time-consuming and labor-intensive. Routing a complex PCB layout can consume up to 30% of a designer’s time, and addressing this issue is not straightforward. We have all encountered this scenario: You spend hours setting the constraints and finally hit the Go button, only to be surprised by the lack of visual appeal and the obvious flaws in the result.
DuPont/Qnity Innovators in Semiconductor Materials Named 2025 Heroes of Chemistry
06/10/2025 | DuPontDuPont today announced that 13 of its current and former scientists and engineers have been named 2025 Heroes of Chemistry by the American Chemical Society (ACS) for an innovative program that progressed semiconductor lithography.