Standard of Excellence: Anticipating Customer Needs Early and Often
The Knowledge Base: At the Forefront of Electronics Manufacturing
Global Citizenship: Training the Next Generation of Talent
Koh Young Technology Showcasing Advanced Packaging Inspection Solutionsat SEMICON Japan
December 3, 2024 | Koh Young TechnologyEstimated reading time: 1 minute
Koh Young Technology, y, the global leader in True 3D measurement-based inspection solutions, will demonstrate its award-winning inspection solutions in Hall 1 Booth 1310 at Tokyo Big Sight on December 12-13, 2024. Our team of experts will be on hand to discuss how our inspection solutions can boost quality and increase yield for advanced and wafer-level packaging. Our team of inspection experts will highlight three different machines: Meister S, Meister D+, and ZenStar.
Meanwhile, at SEMICON Europa Booth C2.549, we will showcase inspection technologies specifically designed for semiconductor and advanced packaging applications, including wafer-level packaging solutions. Our team of inspection experts will highlight three different machines, including:
Meister S Premium In-line 3D Inspection System for Micro Solder Paste Deposits. The Meister S has been qualified for mass production by major semiconductor foundries and Mini/Micro-LED companies for micro solder inspection with superior full 3D inspection performance. Combining innovative vision algorithms and high-resolution optics, the Meister S goes beyond micro solder paste inspection, but also a proven solution for Flux inspection.
Meister D+ The Meister D+ combines industry-leading Moiré technology and Koh Young’s proprietary new optics to support 3D inspection of highly reflective dies, a long-term inspection challenge. Koh Young Technology leverages its expertise in 3D measurement and inspection to address the precise inspection of wafer surfaces, critical dimension measurement, defect detection, and the analysis of complex structures found in semiconductor devices.
ZenStar The ZenStar, making its debut at SEMICON Japan, supports True 3D inspection of highly
reflective dice with a mirror surface. Its unparalleled 2D/3D multi-modal technology combines industry-leading Moiré technology and new Koh Young proprietary optics to provide robust and stable inspection for bleeding-edge applications. With its proprietary deep learning technology, the ZenStar offers enhanced capabilities to inspect defect items like micro-cracks, foreign material, and chipping.
Share on:
Suggested Items
Yamaha Reveals Latest Updates Boosting Ease of Use in 1 STOP SMART SOLUTION
04/01/2025 | Yamaha Robotics SMT SectionYamaha Robotics SMT Section has announced automated programming capabilities in YSUP factory software that streamline program generation for all surface-mount processes, including dispensing, printing, placement, and inspection.
Delvitech Expands Its Presence in Germany with the Appointment of Bijan Thomas Rahideh as Representative
03/31/2025 | DelvitechDelvitech, a leader in AI-driven automated optical inspection solutions, is strengthening its position in the German-speaking market by appointing Bijan Thomas Rahideh as its representative for Bavaria, Austria, and German-speaking regions of Switzerland.
Real Time with... IPC APEX EXPO 2025: Koh Young—AI's Impact on the Electronics Industry
03/27/2025 | Real Time with...IPC APEX EXPOKoh Young's Joel Scutchfield discusses the role of AI in the electronics industry. He emphasizes data quality's importance for automation and the development of AI engines for specific tools. The conversation covers market trends in PCB and semiconductor technologies, trade negotiations, and the challenges of reshoring.
Datest to Highlight Flying Probe Programming and X-ray Testing Services at Upcoming SMTA Texas Expos
03/25/2025 | DatestDatest, a leading provider of integrated PCBA testing, imaging, inspection, and failure analysis services for the electronics industry, is excited to announce it will exhibit in the upcoming SMTA Dallas Expo on Tuesday, April 1st, and the SMTA Houston Expo on Thursday, April 3rd, 2025.
Real Time with... IPC APEX EXPO 2025: Expanding Horizons—Technica's New Partnership and Innovations
03/25/2025 | Real Time with...IPC APEX EXPOFrank Medina and Juan Arango share their enthusiasm for a new partnership that expands Technica's territory and product offerings under EMC's ownership. They highlight unique technologies like laser inspection, which offers faster solutions than traditional methods.