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Nano Dimension Ltd, a leading supplier of Additively Manufactured Electronics (AME) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (AM) 3D printing solutions, announced that its Tarantula Underfill system from its Essemtec product lines received the Global Technology Award for Innovation at the SMTA International 2024 Show (the “SMTA Show”) in Chicago, Illinois.
Essemtec’s Tarantula Underfill system is critical in the additive electronics value chain for assembly of complex devices. It involves dispensing an epoxy-based composite along the edge of a chip, which fills the gap between the chip and the substrate, or printed circuit boards, through capillary action.
This innovation enhances mechanical strength by reducing stresses caused by thermal expansion and vibration, while also improving durability, reliability, thermal cycling, and moisture ingress. This process is critical and in growing demand for industries like aerospace, defense, and heavy-duty sectors, where electronics must withstand harsh conditions and require high durability and robust performance.
The heart of Tarantula Underfill’s innovation is in its non-contact heating solution that enables the underfill process on two-side populated printed circuit boards (“PCBs”) and its precise dispensing control of medium.
Olivier Carnal, General Manager for Additive Electronics, shared, “We are proud to be recognized by the SMTA Show for our innovation. Our Tarantula Underfill product is unique yet flexible. In addition to its primary function as an underfill solution, the Tarantula Underfill offers the full range of Essemtec dispensing machine operations. With five different valve options - time-pressure, volume dispensing, micro screw, solder paste jetting, and glue jetting - it allows us to develop customized solutions to meet almost any customer need.”
Yoav Stern, Nano Dimension’s Chief Executive Officer, added, “I am extremely pleased to be able to announce that we have yet again launched another innovative product, which was designed and produced by our Nano Dimension team in Switzerland. This innovation uniquely meets our customers’ needs. Our ability to deliver this technology for production for large printed circuit boards will allow us to address a wide range of industries immediately.”
