-
-
News
News Highlights
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueAll About That Route
Most designers favor manual routing, but today's interactive autorouters may be changing designers' minds by allowing users more direct control. In this issue, our expert contributors discuss a variety of manual and autorouting strategies.
Creating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
SMTA: Pan Pacific Strategic Electronics Symposium Program Finalized
December 17, 2024 | SMTAEstimated reading time: Less than a minute
SMTA announced that the program is finalized for the 29th Annual Pan Pacific Strategic Electronics Symposium. The event will take place from January 27 to 30, 2025 at the Sheraton Maui Resort on Maui, Hawaii. The symposium strives to build bridges and nurture relationships across all boundaries; oceans and cultures, industries and technologies, companies and individuals with a mission of building the vision and future directions for the electronics industry.
On the afternoon of Monday, January 27, a plenary session will kick off the event followed by a keynote presentation by Boris Murmann, Ph.D., University of Hawaiʻi at Mānoa, titled “AI-Driven Agile Microelectronics.”
On Tuesday, January 28, Anaya Vardya, American Standard Circuits, will deliver the keynote lunch presentation on “Ultra High Density Interconnects (UHDI): A Global Innovation in Electronics Assembly.”
In addition to several inspiring keynotes, this program features ground-breaking research from global experts on Thermal Performance, Microelectronics, Data & Academia, Restricted Temperatures, Technology Adoption, Artificial Intelligence, Harsh Environments, Advanced Packaging, Material Reliability and more.
Suggested Items
High Density Packaging User Group (HDP) Welcomes Lincstech as New Member
07/01/2025 | High Density Packaging User GroupHigh Density Packaging User Group (HDP) is pleased to announce that Lincstech Co., Ltd. (Lincstech) has become a member.
Kitron Strengthens Order Backlog with EUR 11 Million Contract for Defense Communication
07/01/2025 | KitronKitron has received an order valued at EUR 11 million to produce advanced military communication products destined for the European market.
The Global Electronics Association Launches Industry Leading Circularity Resource Hub, Fast-Tracking Cost-Reducing, Efficient Solutions for Manufacturers
07/01/2025 | Global Electronics AssociationToday, the Global Electronics Association – the voice of the electronics industry – launched its Circularity Resource Hub. The Hub provides a centralized home for the latest industry standards, best practices, and resources to accelerate electronics’ sustainable and circular evolution.
TRI Unveils New Multi-Camera AOI, TR7500 SIII Ultra
07/01/2025 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, proudly introduces the new TR7500 SIII Ultra.
EU Defence Electronics Ecosystem Highlighted in Brussels
07/01/2025 | I-Connect007 Editorial TeamIn this interview, Alison James, senior director of Global Electronics Association—Europe (formerly IPC), discusses the European Defence & Security Summit in Brussels, June 9–13, as well as the first IPC–ASD Europe Defense Electronics Summit, June 16, which brought together 70 leaders from across the electronics manufacturing supply chain. ASD is the Aerospace, Security and Defence Industries Association of Europe, and co-hosted both the larger and smaller events.