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SIA Commends Finalization of CHIPS Incentives for GlobalWafers
December 19, 2024 | SIAEstimated reading time: 1 minute
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending finalization of CHIPS and Science Act manufacturing investments announced by the U.S. Department of Commerce and GlobalWafers. The incentives will support the development of semiconductor wafer production in Texas and Missouri.
“The GlobalWafers facilities in Texas and Missouri will expand domestic wafer production—most of which currently occurs in East Asia—and strengthen America’s semiconductor supply chain, job creation, and economic growth. We applaud GlobalWafers for investing boldly in these projects and commend the Commerce Department for continuing to advance vital CHIPS incentives.”
The CHIPS Act is on track to strengthen American manufacturing, create jobs, boost economic growth, and promote national security. The CHIPS Act’s manufacturing incentives have sparked substantial announced investments in the U.S. In fact, companies in the semiconductor ecosystem have announced 90 new projects across 28 U.S. states—totaling hundreds of billions of dollars in private investments—since the CHIPS Act was introduced. These announced projects will create more than 58,000 jobs in the semiconductor ecosystem and support hundreds of thousands of additional U.S. jobs throughout the U.S. economy.
An SIA-Boston Consulting Group report released in May projected the United States will triple its domestic semiconductor manufacturing capacity from 2022—when CHIPS was enacted—to 2032. The projected 203% growth is the largest projected percent increase in the world over that time. The report also projected America will capture over one-quarter (28%) of total global capital expenditures (capex) from 2024-2032.
The U.S. Department of Commerce previously announced incentives for a range of companies and projects that will help strengthen the U.S. semiconductor supply chain.
Suggested Items
SIA Praises Finalization of CHIPS Incentives to Supplement SK Hynix’s $3.87 Billion Investment in Indiana
12/20/2024 | SIAThe Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer commending finalization of CHIPS and Science Act manufacturing investments announced by the U.S. Department of Commerce and SK hynix. The incentives will supplement the company’s $3.87 billion investment in Indiana for advanced packaging operations and R&D.
CHIPS Act Funds SK hynix's $3.87 Billion Investment in U.S. Semiconductor Supply Chain
12/19/2024 | U.S. Department of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce awarded SK hynix up to $458 million in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
GlobalFoundries Sets New Bar as Largest Semiconductor Company to Protect Innovation by Joining LOT Network
12/19/2024 | GlobalFoundriesGlobalFoundries (Nasdaq: GFS) (GF) and LOT Network announced that GF has joined the LOT Network, the world’s largest patent licensing platform and non-profit community of global companies committed to protecting themselves against costly litigation from patent assertion entities (PAEs). With this move, GF joins a community of more than 4,500 companies that include half of the top 20 largest U.S. patent holders, and half of the S&P Global 100 and Fortune 100.
SEMICON Korea 2025 to Spotlight Edge Technologies Shaping the AI Era
12/18/2024 | SEMISEMICON Korea 2025 will take place Feb. 19-21 in Seoul at the COEX offering a comprehensive look into AI-driven technological advancements and edge technologies poised to shape the future of the global semiconductor industry. Themed
Toray Engineering Launches TRENG-PLP Coater: Panel Level Coater for Advanced Semiconductor Packaging
12/17/2024 | ACCESSWIREToray Engineering Co., Ltd. has developed the TRENG-PLP Coater, a high-accuracy coating device for panel level packaging PLP is an advanced semiconductor packaging technology, for which there is growing demand particularly from AI servers and data centers. Sales of the TRENG-PLP Coater will commence in December 2024.