-
-
News
News Highlights
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueLearning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
Training New Designers
Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
The Designer of the Future
Our expert contributors peer into their crystal balls and offer their thoughts on the designers and design engineers of tomorrow, and what their jobs will look like.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
'Qualcomm AI Program for Innovators' Launched to Foster On-Device AI Innovation in the Asia-Pacific Region
December 27, 2024 | Qualcomm Technologies, Inc.Estimated reading time: 2 minutes
Qualcomm Technologies, Inc. announced the launch of the Qualcomm AI Program for Innovators (QAIPI) 2025 - APAC, a new initiative aimed at supporting professional developers and startups from Japan, Singapore, and South Korea to create cutting-edge on-device AI solutions across diverse sectors. Through QAIPI, Qualcomm Technologies is providing exclusive access to resources, mentorship, and training sessions to help participants develop innovative AI-driven applications that span across industries in mobile, Compute and IoT.
QAIPI is designed to encourage developers and startups to build complete end-to-end AI solutions using advanced Qualcomm® technologies and the Qualcomm® AI Hub ecosystem. Participants can utilize the Qualcomm AI Hub to compile trained models for optimized on-device deployment, analyze performance metrics on real devices, and deploy the optimized AI models into their applications. The platform supports multiple domains, enabling seamless AI integration across diverse verticals, from personalized mobile experiences to real-time IoT solutions and intelligent compute.
The Qualcomm AI Program for Innovators (QAIPI) empowers professional developers and startups to develop innovative AI-driven applications.
Applications for QAIPI 2025 are open until April 15, 2025 (11:59 p.m. PST). The program includes two phases: the first phase, open to professional developers and startups in Japan, Singapore and South Korea, focuses on edge-AI model development and optimization on Qualcomm AI Hub, and the second phase (May to October 2025), open to shortlisted startups based in Japan, Singapore and South Korea, will facilitate end-to-end use case development, on Qualcomm provided hardware platforms.
Participants will benefit from a set of incentives. For professional developers, QAIPI offers online training sessions and recognition through personalized digital badges. Startups selected for Phase-2 will receive additional support, including six months of dedicated mentorship, access to Qualcomm Technologies’ hardware or development kits for product development, a participation stipend valued at up to US$5,000, and eligibility to receive a patent filing incentive of up to US$5,000. Shortlisted startups will have the chance to showcase their innovations at a high-profile virtual Demo Day in Q4 2025 to an audience of industry leaders, investors, and potential collaborators.
Startups registered in Japan, Singapore and South Korea will receive six-months’ mentorship and access to tools for project development.
“AI is reshaping industries globally, and we are excited to empower innovators in the Asia-Pacific region to lead this evolution,” said O.H. Kwon, Senior Vice President & President, Qualcomm APAC. “We are committed to driving energy-efficient, privacy-focused, and scalable AI innovations that advance industries and transform lives worldwide. With QAIPI, we are enabling professional developers and startups to create solutions that redefine user experiences and set new benchmarks for efficiency and scalability. This program reflect our commitment to fostering innovation and building a stronger ecosystem for AI-driven technologies.”
“Qualcomm is fostering a robust innovation ecosystem that infuses billions of devices with connected intelligence,” said Sudeepto Roy, Vice President of Engineering for Qualcomm Incorporated and Lead of Qualcomm’s Global Ecosystem Development Program. “A profound revolution is underway at the cyber-physical edge, where AI meets the diverse needs of humans, machines, and businesses. Through QAIPI, we will equip innovators with comprehensive technical and IP training, mentorship, and cutting-edge platforms, enabling them to excel in this dynamic space. By developing end-to-end AI use cases on devices, we aim to address societal, governmental, and industry needs in a sustainable and scalable manner.”
Suggested Items
Pudu Robotics' PUDU T300 Achieves CE-MD and CE-RED Certifications, Empowering Global Smart Manufacturing with International Safety Standards
03/14/2025 | PRNewswirePudu Robotics, a global leader in service robotics sector, announced its innovative industrial delivery robot, the PUDU T300, has obtained both the CE-MD (Machinery Directive) and CE-RED (Radio Equipment Directive) certificates by TÜV SÜD, a world-renowned testing and certification organization.
DELO Releases IBOA-free Medical Adhesive for Glucose Monitoring Sensors and Other Wearables
03/14/2025 | DELODELO has released a new light-curing medical-grade adhesive engineered with nontoxicity in mind. DELO PHOTOBOND MG4047 is designed for wearable medical applications such as glucose monitoring sensors (CGM). Its chemical properties and impermeable characteristics help prevent skin irritation in cases of media influence such as rain or sweat.Teaser
Collins Aerospace Approved to Begin Full Rate Production of MAPS Gen II system
03/13/2025 | Collins AerospaceCollins Aerospace, an RTX business, has received approval for Full Rate Production of the Mounted Assured Positioning, Navigation and Timing (PNT) Generation II system (MAPS GEN II).
Eltek Reports Full Year and Q4 2024 Financial Results
03/13/2025 | EltekEltek Ltd., a global manufacturer and supplier of technologically advanced solutions in the field of printed circuit boards (PCBs), today announced its financial results for the full year and fourth quarter ended December 31, 2024.
YINCAE: UF 158UL Redefines Underfill for Large Chips
03/12/2025 | YINCAEYINCAE, a leading innovator in advanced materials solutions, today announced the launch of its groundbreaking underfill material, UF 158UL. This cutting-edge product is designed to meet the increasing demands of large format chips, offering unparalleled performance in room temperature flow, fast cure, and high reliability.